半导体集成电路概述

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1、半导体集成电路IC常用术语园片：硅片芯片(Chip,Die)：6、8：硅（园）片直径：1＝25.4mm6150mm;8200mm;12300mm;亚微米<1m的设计规范深亚微米<=0.5m的设计规范0.5m、0.35m－设计规范（最小特征尺寸）布线层数：金属（掺杂多晶硅）连线的层数。集成度：每个芯片上集成的晶体管数IC工艺常用术语净化级别：Class1,Class10,Class10,000每立方米空气中含灰尘的个数去离子水氧化扩散注入光刻…………….最小线宽变化生产工厂简

2、介PSIFabTwowascompletedJanuary2,1996andisa"StateoftheArt"facility.This2,200squarefootfacilitywasconstructedusingallthelatestmaterialsandtechnologies.Inthissetofcleanroomswechangetheair390timesperhour,ifyoudothemathwithULPAfiltrationthisisaClassOnefacili

3、ty.WehavehadittestedanditdoesmeetClassOneparameters(withoutanypeopleworkinginit).Sincewearenotmakingmicroprocessorshereandwedon'twanttowear"spacesuits",werunitasaclass10fab.EventhoughitconsistentlyrunswellbelowClassTen.HereintheFabTwoPhotolithographyar

4、eaweseeoneofour200mm.35micronI-LineSteppers.thissteppercanimageandalignboth6&8inchwafers.AnotherviewofoneoftheFabTwoPhotolithographyareas.Hereweseeatechnicianloading300mmwafersintotheSemiTool.Thewafersareina13waferTefloncassetteco-designedbyProcessSpec

5、ialtiesandSemiToolin1995.Againthesearetheworld'sfirst300mmwetprocesscassettes(thatcanbespinrinsedried).AswelookinthiswindowweseetheWorld'sFirsttrue300mmproductionfurnace.Ourdevelopmentanddesignofthistoolbeganin1992,itwasinstalledinDecemberof1995andbeca

6、mefullyoperationalinJanuaryof1996.Herewecanseetheloadingof300mmwafersontothePaddle.ProcessSpecialtieshasdevelopedtheworld'sfirstproduction300mmNitridesystem!Webeganprocessing300mmLPCVDSiliconNitrideinMayof1997.2,500additionalsquarefeetof"StateoftheArt"

7、ClassOneCleanroomiscurrentlyprocessingwafers!Withincreased300mm&200mmprocessingcapabilitiesincludingmorePVDMetalization,300mmWetprocessing/Cleaningcapabilitiesandfullwafer300mm.35umPhotolithography,allinaClassOneenviroment.CurrentlyourPS300AandPS300Bdi

8、ffusiontoolsarecapableofrunningboth200mm&300mmwafers.Wecanevenprocessthetwosizesinthesamefurnaceloadwithoutsufferinganyuniformityproblems!(ThermalOxideOnly)AccuracyinmetrologyisneveranissueatProcessSpecialties.Weusethemostadvancedroboti