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1、光导印制板工艺研究与开发DevelopmentofOptical-ElectricalPrintedCircuitBoard吴金华1，MarikaImmonen2，罗永红11上海美维科技有限公司，ShanghaiMeadvilleScience&TechnologyCo.,Ltd.2美维爱科（国际）有限公司，MeadvilleAspocompInternationalLtdØ第一作者简介：·姓名：吴金华·出生年月日：1981-10·性别：男·毕业学校：上海大学·最高学历：硕士·职称：工程师·现在主要从事工作：工艺开发，包括半加成法，隐埋器件、光导板、全印制电路技
2、术等。Ø摘要：本文首先简要介绍了现有光导印制板（以下简称光导板）的技术特点，然后以一款测试板为主，介绍了该板的结构、制作控制以及后续的性能测试，最后对光导板未来的发展趋势作了展望。关键词：光导板，波导，数值孔径，传输损耗，微镜ØAbstract:State-of-artO/EPCBtechnologiesweredescribedatfirst.Structureoftestsamplewasintroducedandthekeyprocesseswereinvestigated.Boardperformancessuchasthemorphology,tran
3、smissionlossofthewaveguideandthereliabilitywerecharacterizedinthisreport.Lastbutnottheleast,thetrendofO/EPCBtechnologywasalsodiscussedhere.Keywords：optical-electricalboard,waveguide,numericalaperture,transmissionloss,micro-mirrorØ参考文献：1EdrisMohammed,AndrewAlduino,ThomasThomas,etc.,Op
4、ticalInterconnectSystemIntegrationforUltra-Short-ReachApplications,IntelTechnologyJournal,Volume8,Issue2,20042DaweiHuang,Opticalinterconnects:outoftheboxforever?IEEEjournalofselectedtopicsinquantumelectronics,Vol.9,No.2,March/April20033JingYuan,FengguangLuo,XinjunZhou,etc.,Opticalint
5、erconnectioninembedded-fiberprintedcircuitboards,Optik,119(2008)46-504YaoLi,Board-level2-Ddata-capableopticalinterconnectioncircuitsusingpolymerfiber-imageguides,proceedingoftheIEEE,Vol.88,No.6,June20005JasonChaffey,MikeAustin,IgorSwitala,In-planereactiveionetchedfibregroovesforoptic
6、alintegrationandcoupling,MicroelectronicEngineering,71(2004)98-1036KentarouTamaki,HideakiTakase,YuuichiEriyama,etc.,RecentProgressonPolymerWaveguideMaterials,JournalofPhotopolymerScienceandTechnology,16(5),2003,639-6487FuKai,ResearchofOpticalInterconnectionWaveguideforEOPCB,HuazhongU
7、niversityofScienceandTechhnology,20058Joon-SungKimandJang-JooKim,FabricationofMultimodePolymericWaveguidesandMicromirrorsUsingDeepX-RayLithography,IEEEPHOTONICSTECHNOLOGYLETTER,VOL.16,NO.3,20049MarikaImmonen,DevelopmentofLow-CostManufacturingMethodsforVolumeProductionofOpticalPrinted
8、CircuitBoard
