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《印制电路板显微剖切孔无铜技术分析.（analysis of copper free technology for micro cut hole of printed circuit board）》由会员上传分享，免费在线阅读，更多相关内容在教育资源-天天文库。
1、印制电路板显微剖切孔无铜技术分析.（Analysisofcopperfreetechnologyformicrocutholeofprintedcircuitboard）ThisarticleiscontributedbyFXQ1982DOCdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyoufirstselectTXT,ordownloadthesourcefiletothelocalview.Physics,microsectionana
2、lysismethod,trainingmaterialsTiny,slice,of,physics,analytical,method,training,teaching,materialPhysicalexperimentpersonnelessentialThe,physics,experiments,the,personnel,essentialEditor:strengtheningthepartyLiJiaZhongshanBaoyueElectronicsCo.Ltd.QAdepartmentZhongshanB
3、aoyueKerryElectronicsCo.,thequalityassurancedepartmentStrengtheningPartyTheresearchofprintedcircuitboardmicrocuttingdetectiontechnologyMicrosectioning,Study,on,the,Technology,of,the,Microsectioning,of,the,,Printed,Circuit,BoardAbstract:Thispaperintheprintedcircuitbo
4、ardMICROSECTIONINGtechniqueanditsapplicationtopracticaldiscourse.Inthispaper,themicrodissectiontechnologyofprintedcircuitboardanditsapplicationarediscussedindetail.Scope:Jia-BaoYue-Theme:plate,copperplateholewithoutadverseside,One,200timesThequalityoftheboardsusedin
5、thePCBwilldirectlyaffectthequalityoftheboardsandthequalityoftheproducts.Heavyimpactonproductquality.Figure1.2.3.4isthefactthattheprintedboardholeisnotcopperscrapduetoplatefactors.Thefactthatthereisnocopperscrap.Figurestwo,100,two,Analysis:Figure1.2.Whenthemicroscope
6、isenlarged100times,itisfoundthattheresinisveryloose,andthereisanemptyhole.Itisfoundthattheresinislooseandhasvoids.Two,indrilling,thehigh-speedrotationofthedrillknifewillinevitablymovelooseresin,resultinginroughholewall,measurementswillpulllooseresin,resultinginrough
7、holewall,1.2roughnessof66-99UM.Roughnessexceedingstandard,66-99UM.Roughnessroughnessrequirementsexceedthestandardseriously,generallylessthanorequalto30UM.isdoublesidedplywoodforgeneralroughnessrequirementsfordouble-sidedmultilayerboardislessthanorequalto25UMlessthan
8、30UM.25UM.Three,theholewallistoorough,willleadtothequalityoftheprocessaftertheemergenceofcoating,resultinginnocopperholescrapped.Theproble
