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1、印制电路板显微剖切孔无铜技术分析（Analysisofcopperfreetechnologyformicrocutholeofprintedcircuitboard）DOCdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyoufirstselectTXT,ordownloadthesourcefiletothelocalview.Physics,microsectionanalysismethod,trainingmaterialsTiny,slice,of,physics,analytical,metho
2、d,training,teaching,materialPhysicalexperimentpersonnelessentialThe,physics,experiments,the,personnel,essentialEditor:strengtheningthepartyLiJiaZhongshanBaoyueElectronicsCo.Ltd.QAdepartmentZhongshanBaoyueKerryElectronicsCo.,thequalityassurancedepartmentStrengtheningPartyTheresearchofprintedcircuitb
3、oardmicrocuttingdetectiontechnologyMicrosectioning,Study,on,the,Technology,of,the,Microsectioning,of,the,,Printed,Circuit,BoardAbstract:ThispaperintheprintedcircuitboardMICROSECTIONINGtechniqueanditsapplicationtopracticaldiscourse.Inthispaper,themicrodissectiontechnologyofprintedcircuitboardanditsa
4、pplicationarediscussedindetail.Scope:Jia-BaoYue-Theme:plate,copperplateholewithoutadverseside,One,200timesThequalityoftheboardsusedinthePCBwilldirectlyaffectthequalityoftheboardsandthequalityoftheproducts.Heavyimpactonproductquality.Figure1.2.3.4isthefactthattheprintedboardholeisnotcopperscrapdueto
5、platefactors.Thefactthatthereisnocopperscrap.Figurestwo,100,two,Analysis:Figure1.2.Whenthemicroscopeisenlarged100times,itisfoundthattheresinisveryloose,andthereisanemptyhole.Itisfoundthattheresinislooseandhasvoids.Two,indrilling,thehigh-speedrotationofthedrillknifewillinevitablymovelooseresin,resul
6、tinginroughholewall,measurementswillpulllooseresin,resultinginroughholewall,1.2roughnessof66-99UM.Roughnessexceedingstandard,66-99UM.Roughnessroughnessrequirementsexceedthestandardseriously,generallylessthanorequalto30UM.isdoublesidedplywoodforgeneralroughnessrequirementsfordouble-sidedmultilayerbo
7、ardislessthanorequalto25UMlessthan30UM.25UM.Three,theholewallistoorough,willleadtothequalityoftheprocessaftertheemergenceofcoating,resultinginnocopperholescrapped.Theproblemiscausedbycopperscrap.Figuresthre
