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时间:2018-07-11
《湿热环境下微电子互连acf的导电及腐蚀行为》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、湿热环境下微电子互连ACF的导电及腐蚀行为华丽1a,1b,2,郭兴蓬1a,杨家宽1b,刘凤鸣1a(1.华中科技大学a.化学与化工学院;b.环境科学与工程学院,湖北武汉430074;2.湖北第二师范学院化学与生命科学学院,湖北武汉430205)摘要:各向异性导电胶膜(anisotropicconductiveadhesivefilm,ACF)替代锡铅(Sn/Pb)钎料已应用于微电子封装中。以聚苯乙烯微球(Polystyrene,PSt)(3~5μm)为导电核心体,其表面化学镀一层Ni粒子(1~2μm)形成的复合微球填充在树脂中形成的各向异性导电
2、胶膜作为研究对象,采用交流阻抗和动电位扫描等方法,探讨了湿热环境下ACF胶膜导电及耐蚀性能。实验表明,高温(80℃)和高湿(RH85%)中老化4h后,各向异性导电胶膜的接触电阻有较显著的增加,所致原因是湿热环境下起导电作用的Ni粒子氧化阻止了电流穿越,且温度的影响大于湿度的影响,两者协同作用加速各向异性导电胶膜(ACF)互连失效。对比实验表明,ACF耐腐蚀性能明显高于锡铅钎料,原因是基体胶对导电粒子的保护作用,阻碍了腐蚀介质向内部扩散。关键词:微电子封装;各向异性导电胶;腐蚀行为;电阻变化;动电位极化;交流阻抗中图分类号:O646.6文献标志
3、码:AElectronicconductiveattributesandcorrosivebehaviorofACFunderthermalhumidconditionsformicroelectronicinterconnectionHUALi1a,1b,2,GUOXing-peng1a,YANGJia-kuan1b,LIUFeng-ming1a(1a.SchoolofChemistryandChemicalEngineering;1b.SchoolofEnvironmentalScienceandEngineering,HUST,Wuha
4、n,Hubei430074,P.R.China;2.SchoolofChemistryandLifeScience,HubeiUniversityofEducation,Wuhan,Hubei430205,P.R.China)Abstract:Anisotropicconductiveadhesivefilm(ACF)ischosentosubstituteforSn/Pbsolderandappliedtomicroelectronicpackaging.Inthisthesis,ACFiscomposedofpolystyrenemicr
5、ospheres(PSt)(3~5μm)platedwithathinNiparticles(1~2μm)outsideandaspecialepoxyresin.BothofthemaremixedtobeACF.ElectronicconductiveattributesandcorrosiveresistancebehaviorofACFareanalyzedbyalternatingcurrentimpedancemeasurementandpotentiodynamicpolarizationunderhighlythermalhu
6、midconditions.Theresultsshowthatafteraging4hin80℃and85%RHcondition,contactresistanceofACFincreasesgreatly,andthemainreasonistheoxidationformationofNipreventselectriccurrentfromgoingthrough.Furthermore,theeffectoftemperatureoncorrosivebehaviorofACFexceedstheeffectofhumidity,
7、andbothofthemacceleratethefailureofACFreliabilityinmicroelectronicinterconnection.CorrosionresistancesofACFarebetterthanthatofSn-37Pbsolderinthesamecase.ThepossiblereasonisthatNiis收稿日期:2010-04-15基金项目:国家自然科学基金资助项目(50671040,50871044);湖北省教育厅重点资助项目(D20093103);湖北省教育厅高校产学研合作重点资助项
8、目(C2010071)作者简介:华丽(1974-),女,华中科技大学博士,主要从事电化学腐蚀和微电子封装中可靠性问题研究。郭兴蓬(联系人),男,华中科技大学教授,博
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