KLA缺陷检查培训.ppt

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1、OverviewKLABasicOperation121xxCapabilities23RunOverview4RunonewaferInspectionQueue56789StoppingtheInspection10DefectOverviewWhymonitordefects?Toimproveproductionyields,defectsneedtobemonitoredandstatisticallyanalyzedateachstageofwaferproduction.11DefectSort1.Fals

2、e:Foundnothingafterreviewwithinspectiondata.2.Unkown:Defectswerefoundbutthereisnosuitabledefectcodetoassign.3.Fallonparticle:Particleonsurfaceofpatten.4.Infilmparticle:Particlewascontainedinfilm,suchaspoly,HDP,metalandsoon.HDPPoly125.Scratch:Especiallyforscratchc

3、ausedbyrobot,othertoolpartsorman-made.Defectmap:Defectiamge:MicroMacro136.Discolor:Colordifference7.Masking：Shouldbeetchedbutstillremian(poly,SiN,spacer,metalandsoon).Someconnectmorethantwolines,it’sbridge(killer).148.Ringlikedefect:SuchasdefectscausedbyARCsplash

4、,usuallyrelatedtoPHOTO.PolyMetal9.Grapelikedefect:InducesbyPHOTOPU.1510.Residue：Alwayshappenafterwetstationclean.11.Pattenabnormal:Roughness,Defocus,Pattenshiftandsoon.RoughnessDefocusPattenshiftPattenAbnormal1612.Concave:COP（Crystalorientedpits）,OxideLoss，Pits.1

5、3.Peeling:Patternshiftormissing（Wplugisoneofpeeling,alwaysappearatwaferedge.）1714.Blind:CTorViahavenotbeenopened.15.Pattendamage:MetaldamagePolybrokenispattendamagetoo,alwayshappenduringHighImp.1816.WResidue:1).CausedbyOxideLoss;2).CausedbyCMP.NORMALABNORMAL17.Un

6、der_Pat：Underlayerpatternfailissue.1918.Salicide_abnormal:Salicidepoorformation.19.Grain:Includingpolyormetalgrain.2020.Slurry:21.PR/Polymer_remain:PRhasnotbeenstrippedcompletely,typicallycontainsCarbon2122.Arcing:23.Lineopen:2224.Corrosion:Causedbyetchstripchamb

7、erorbadenvironment.Thistypedefectis100%killerdefect.23EndThankYou!24