Contact and Interconnection

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1、Chapter8ContactandInterconnectionI.ContactandInterconnection–IncreasingimportanceforVLSI/ULSITechnologyII.AdvancedContact&InterconnectionTechnology–IntegrationofvariousthinfilmmaterialsandprocesstechniquesIII.ContactResistanceIV.Al/SiOhmicContactandInterconnectV

2、.CuInterconnectionbyDamasceneTechnologyVI.Silicide.PolycideandSalicide1Chapter8ContactandInterconnectionI.ContactandInterconnection–IncreasingimportanceforVLSI/ULSITechnologyRequirementsandproblemsofC&IforICProgress(1)HighSpeed:¢Lowinterconnectresistance¢Lowcont

3、actresistance¢LowcapacitanceProblem:RC↑LR=ρ(+Contactresistance)wtLwC=ε(+Line-to-LineC)iti2εiRC=LR↑sti(2)Highreliability¢Uniformmetal/Siinterface¢LowelectromigrationProblem:--Metal/Si:interdiffusion&interactionÆAl“Spiking”–Contactfailure--Electromigration–voidfor

4、mation–interconnectfailure(3)Highdensity--Smallercontact,morenarrowmetalline--Multilevelmetallization2/3PGA=NA–ChipareaG–NumberofICgatesP–Metalpitch(linewidth+space)N–NumberofmetallevelsProblems:Increasingprocesscomplexity∴C&I–OneofthebottlenecksfordeepsubµICtec

5、hnology!2II.AdvancedContact&InterconnectionTechnology–Integrationofvariousthinfilmmaterialsandprocesstechniques1.VariousmaterialsforC&IòForearlyIC:AlòAtmediumstage:(≥2-3µm)Al+DopedPoly-SiòForAdvancedVLSI/ULSI:(1)Highconductivemetal&itsalloy:Al,Al-Si,Al-Si-Cu,Cu+

6、(2)HeavilydopedpolySi:n-+Poly-Si,p-Poly-Si(3)Refractorymetals:W,Ta...(4)Metalsilicide:TiSi2,CoSi2,PtSi,NiSi,WSi2(5)Othermetalalloyandcompound:TiN,WN…+Differentdielectricfilms:Inorganic:SiO2,PSG,BSG,BPSGOrganicpolymers2.Combinationofvariousprocessingtechnology(1)

7、Self-alignedtechnology:*Self-alignedpoly-Sigateandpolycidegatetechnology*Self-alignedsilicidecontactandgatetechnology(salicide)(2)Diffusionbarriertechnology(3)MultilevelinterconnectionCMOS:0.5µm---3-4Levels;0.35µm---4-5Levels;130nm--8Levels;90nm--9Levels;65nm--1

8、0Levels(byITRS2001)(4)LayeredmatallizationstructureSi(Al)/Contact(adhesion)layer/Diffusionbarrierlayer/Verticalinterconnect/Lateralinterconnect/Anti-reflection(cappin