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1、JournalofSolidMechanicsVol.4,No.7,2010andMaterialsEngineeringStudyonPeelingBehaviorinPick-upProcessof*ICChipwithAdhesiveTapes******NaoyaSAIKI,KazuakiINABA,KikuoKISHIMOTO,******HideoSENOandKazuyoshiEBE**DepartmentofMechanicalSciencesandEngineering,TokyoInstituteofTechnology,2-12-1Ookayama,Megu
2、ro-ku,Tokyo,152-8550JapanE-mail:saiki.n.aa@m.titech.ac.jp(n-saiki@post.lintec.co.jp)***LINTECCorporation,5-14-42Nishiki-cho,Warabi-shi,Saitama,335-0005JapanAbstractAmethodtoevaluatepick-upperformanceoffourkindsofadhesivetapematerialswithdifferentthicknesshasbeenstudiednumericallyandexperiment
3、ally.NeedlespeelanICchipwithanadhesivefilmoffthebasematerialinthepick-upprocess,bypushingthebackofthebasematerial.Inourevaluationmethod,thedependenceofthepeelenergyonthepeelspeedwasmeasuredusingapeeltest.Thefiniteelementmethodwasappliedtocalculatetheenergyreleaserateofthepick-upprocessforvari
4、ouspeellengths.Thepick-uptimewasobtainedfromtheresultsofthepeeltestsandthefiniteelementanalysis.Ourresultsindicatethatthepeelenergyisthedominantpropertyinfluencingthepick-upperformance,andthedifferenceinenergyreleaserateinthepick-upprocessbetweenthesamplesisnotsignificant.Furthermore,theminim
5、umneedledisplacementwasestimatedfromthecalculatedpick-uptimeusingourmethod.Theminimumneedledisplacementoftheexperimentalpick-upvalueswasingoodagreementwiththeestimatedresult.Keywords:Adhesive,PeelTest,PolymerMaterials,ElectronicMaterials,Interface1.IntroductionIncreasingmarketdemandhasdrivent
6、hesemiconductorindustrytominiaturizeallthematerialsusedinsemiconductorpackaging(Fig.1).TheadhesivesthatbondICchipstothesubstratehavealsofollowedthemarkettrendtowardsminiaturization.Filmadhesivesareabletosatisfythisdemand,andarenowwidelyused,havingreplacedconventionalliquidadhesives.Suchadhesi
7、vesarethinnerandmoreuniformthanliquidadhesives,andthisisthereasonwhyfilmadhesivesenablesmaller,higherfunctionalitydevicesthroughchip(1)stackedtechnologyasshowninFig.1.(a)BladeAdhesivesICchipsAdhesiveICchipBasematerialSolderbumpsSubstrate(b)Ad
