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时间:2019-03-03
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1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGUNITCONVERSIONFACTORSTemperatureKC273C1.8(F32)RF460Length1m1010A˚3.28ft39.4inMass1kg2.2lbmForce1N1kg-m/s20.225lbfPressure(stress)1P1N/m21.45104psiEnergy1J1W-s1N-m1V-C1J0.239cal6.241018eVCurrent1A1C/s
2、1V/CONSTANTSAvogadro’sNumber6.021023mole1GasConstant,R8.314J/(mole-K)Boltzmann’sconstant,k8.62105eV/KPlanck’sconstant,h6.631033J-sSpeedoflightinavacuum,c3108m/sElectroncharge,q1.61018CSIPREFIXESgiga,G109mega,M106kilo,k103centi,c102milli,m103micro,106nano
3、,n109DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER1INTRODUCTIONTOMICROSY
4、STEMSPACKAGINGProf.RaoR.TummalaGeorgiaInstituteofTechnology.................................................................................................................DesignEnvironmentICThermalManagementPackagingMaterialsSingleChipOptoandRFFunctionsDiscretePassive
5、sEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthew
6、ebsite.INTRODUCTIONTOMICROSYSTEMSPACKAGING.................................................................................................................1.1WhatAreMicrosystems?1.2MicrosystemTechnologies1.3WhatIsMicrosystemsPackaging(MSP)?1.4WhyIsMicrosystemsPackaging
7、Important?1.5System-LevelMicrosystemsTechnologies1.6WhatisExpectedofYouasaMicrosystemsEngineer?1.7SummaryandFutureTrends1.8WhoInventedMicrosystemsandPackagingTechnologies?1.9HomeworkProblems1.10SuggestedReadingCHAPTEROBJECTIVESIntroducetheconceptofMicrosystemsPresent
8、MicrosystemsbuildingblocktechnologiestocontainMicroelectronics,Photonics,MEMS,andRF/WirelessDescribetheroleofPackagi
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