欢迎来到天天文库
浏览记录
ID:33357818
大小:1.50 MB
页数:55页
时间:2019-02-25
《03型复合电子封装材料的理论计算与优化设计》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、AbstractThepulsedelectricalene唱ycausedbychemicalene玛yisbetterthaJltlle仃aditionaloneinthespecialapplicationforitshi曲energystoragedensity,10wc印acity'11igllresist锄ttotheelec怕ma朗eticinterfereIlce.It’sad印ttoene玛ystoragecapacitorWhenit’susedintllet啪sducerSoit’sVe巧iInpo
2、rtamtopayresearchonthe10wdielectricconstant,hi曲acousticimped肌ce,goodstressdistribution,new锄capsulationmaterials.Firstly'asimplemodelformedi触entco肌ectiVity(O-3觚d1-3)ofelecnDnic∞c印sulationhasbeendeVelopedwheremeVol啪e矗actionofmepaIticlephaseiscalculatedtooptimizethe
3、dielectricconstam,specificimpedance趴dtllelor酒tudinalvelocity.Ialsocomparewimdi仃erentp01ymermatrix.7I’lleresultindicatesmattheperfo姗鲫ceoftlleconlpositesincreases1inearlywimtheVolume疳actionofthepanicle.The1—3connectiVityisla玛既、th锄tlle0-3connectiVityuIlderthes锄evolu
4、me劬ctioncolldition.Theselectionoftllep01ymerisalsodiscussedindetail.ItiIldicatesthatthepolymerh弱agreatlyeffectonthedielectricconstantalldacousticiInpedance.Thehi曲erdielec印cconstant,sti能rpanicle锄dthe10werdensity,sonerpolymeraregoodforourdesign.Therefore,tllemodeli
5、ngisagoodwaytodcSignthecompositeinthesmartstnlcturefortr锄sducerpackaging.Secondly,byutilizingmefiniteel伽【lentmemodcombinedWithcellmodels,meefrcctsofsonmatrixmo印holo西escompositeswitllhardreinforcingpaniclesareinvestigated.Anewmodelnotconsid甜ngtllepaIticleh嬲beenuse
6、dforourresearchwiththea】【isymmetricunitcenmodel,comparedwithmecl嬲sicala)【isymmetricceUmodel,tal【ingmepanicleintoconsideration.Thecylin曲calaIldthesphericalinClusionhavebeencalculatedusingthetwodifrerentmodels.Thedi位rentmatrixmo印h010百eshavebeenusedtoproVeournewmode
7、l.Theefrectsofmatrixnowhihavioronthestressdistributionofmematrixhavebeenderivedusingthebothmbdels.Theresultsshowtllatnlesphericalparticleise弱iertocompressmaIlthecylindlic以oneandit’s900dformedimple矗.actl】reoftllematrix.Ma仃奴mo啦bologiesalsohaVeeffecton也estressdistri
8、butionoftllecomposite.1西ywords:PaniclereinforCedconlposites,physicalmodel,acousticimpendence,dielectricconstant,stress,particlemo印hologiesII西北工业大学学位论文知识产权声明书本人
此文档下载收益归作者所有