普通多层板生产流程

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1、普通多层板生产流程ManufacturingProcessofNormalMulti-layerboard下料MaterialPreparation将大料切割成生产尺寸。Cutsheetintoworkingpanels.内层蚀刻InnerEtching内层贴膜Inner-layerLamination内层曝光Inner-layerExposure内层蚀刻Inner-layerDES层压Lamination黑氧化OxideReplacemnetPIN层压或MASS层压PINLaminationorMassLamination层压后处理P

2、ressingPostTreatment钻孔Drilling机械钻孔MechanicalDrilling孔金属化及板面电镀PTH&PanelPlating垂直PTHVerticalPTH板面电镀PanelPlating外层干膜O/LDryFilm外层贴膜Outer-layerLamination外层曝光Outer-layerExposure外层显影Outer-layerDeveloping干膜图形电镀PatternPlating二次铜Sn镀上二次铜及锡层SecondcopperplatingandSnplating干膜外层蚀刻Out

3、erEtching去膜D/FStripping蚀刻Etching去锡SnStripping湿绿油SolderMask绿油阻焊前处理S/MPretreatment阻焊印刷S/MImaging阻焊曝光S/MExposure阻焊显影S/MDeveloping表面处理SurfaceTreatment表面处理：化学镍金ENIG字符ComponentMark印字符Silkscreen铣外形Routing将生产板铣成出货单元电测试E-test通过电测试，检验开短路外观检验检验外观缺陷包装Packaging将电测试和外观检验的板包装好。结束

4、TheEnd