最新pcb 英文缩写及术语ppt课件.ppt

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1、pcb英文缩写及术语一.企業常用縮寫部分FCST:預估(Forecast)PO/SO:訂單(PurchaseOrder/SalesOrder)BP:營運計劃(BusinessPlan)MRP:物料需求規劃(MaterialRequirementPlanning)PR:採購申請PurchaseRequestBOM:物料清單(BillOfMaterial)IQC:進料品質管制(IncomingQualityControl)IPQC:製程品質管制(In-ProcessQualityControl)FQC:成品品質管制(FinishorFinalQualityControl)OQC

2、:出貨品質管制(Out-goingQualityControl)QA:品質保證(QualityAssurance)QC:品質管制(QualityControl)QCC:品管圈(QualityControlCircle)QIT:品質改善小組(QualityImprovementTeam)QE:品質工程(QualityEngineering)SFC:現場控制(ShopFloorControl)TPM:全面生產管理TotalProductionManagementTQC:全面品質管制(TotalQualityControl)TQM:全面品質管理(TotalQualityManag

3、ement)WIP:在製品(WorkInProcess)P/N:料號(PartNumber)PNL:小型版面(Panel)S/M:防焊(SolderMask)PDM:產品資料管理系統(ProductDataManagement)ECD:預計完成日期(EstimatecompletionDate)SCH:時間表/計劃表(Schedule)KLM:負責人(KeyLineManager)A/W:底片(Artwork)*ProcessModule說明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(Shearmateri

4、altoSize)B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)C.乾膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Str

5、ipping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)DES二.專業術語部分d-3鉚釘組合(eyelet)d-4疊板(Layup)d-5壓合(Lamination)d-6後處理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d

6、-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction)e-1薄化銅(CopperReduction)F.電鍍(HorizontalElectrolyticPlating)f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂帶研磨(BeltSanding)

7、f-6剝錫鉛(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)H.防焊(綠漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3靜電噴塗(SprayCoating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)