Michael-quirk-半导体制造技术-第15章-光刻-光刻胶显影和先进的光刻技术.ppt

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1、SemiconductorManufacturingTechnologyMichaelQuirk&JulianSerda©October2001byPrenticeHallChapter15Photolithography:ResistDevelopmentandAdvancedLithography©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaObjectivesAfters

2、tudyingthematerialinthischapter,youwillbeableto:1.ExplainwhyandhowapostexposurebakeisdoneforconventionalandChemicallyamplifiedDUVresist.2.DescribethenegativeandpositiveresistdevelopmentprocessforconventionalandchemicallyamplifiedDUVresist.3.Listanddi

3、scussthetwomostcommonresistdevelopmentmethodsandthecriticaldevelopmentparameters.4.Statewhyahardbakeisdoneafterresistdevelopment.5.Explainthebenefitsofapost-developinspection.6.Listanddescribethefourdifferentalternativesforadvancedlithography,includi

4、ngthechallengesforintroducingeachalternativeintoproduction.7.Describeandgivethebenefitfortheadvancedresistprocessoftopsurfaceimaging.EightBasicStepsofPhotolithographyTable15.1PostExposureBakeDeepUVExposureBakeTemperatureUniformityPEBDelayConventional

5、I-LinePEBAmineContaminationofDUVResistleadingto“T-top”FormationPAGPAGPAGPAGPAGPAGPAGPAGH+H+H+H+H+H+H+H+H+H+}RegionofunexposedphotoresistNeutralizedphotoresistAcid-catalyzedreactionofexposedresist(postPEB)DevelopmentResistT-toppingFigure15.1Reductiono

6、fStandingWaveEffectduetoPEB(d)ResultofPEBPACPACPACPACPACPACPACPACPACPACPACPACPACPACPACPACPAC(c)PEBcausesPACdiffusionPACPACPACPACPACPACPACPACPACPACPACPACPACPACPACPACPACUnexposedphotoresistExposedphotoresist(b)StriationsinresistPACPACPACPACPACPACPACPAC

7、PACPACPACPACPACPACPACPACPACPACPACPACPACPACPACStandingwaves(a)ExposuretoUVlightFigure15.2DevelopNegativeResistPositiveResistDevelopmentMethodsResistDevelopmentParametersPhotoresistDevelopmentProblemsXXXÖUnderdevelopIncompletedevelopCorrectdevelopSever

8、eoverdevelopResistSubstrateFigure15.3NegativeResistCrosslinkingUVCrosslinksUnexposedresistExposedresistFigure15.4DevelopmentofPositiveResistResistexposedtolightdissolvesinthedevelopchemical.UnexposedpositiveresistCrosslinkedresistFigure15.5Developmen