芯片绑定介绍ppt课件.ppt

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1、WIREBONDPROCESSINTRODUCTIONCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPla

2、cementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPL

3、E銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepre

4、solutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclampXYTableLinear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Ful

5、lyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdeviceEagleBondingSystemBondingMethodThermosonic(TS)BQMModeConstantCurrent,Voltage

6、,PowerandNormal(Programmable)LoopTypeNormal,Low,Square&JXYResolution0.2umZResolution(capillarytravellingmotion)2.5umFinePitchCapability35mmpitch@0.6milwireNo.ofBondingWiresupto1000ProgramStorage1000programsonHardDiskMultimodeTransducerSystemProg

7、rammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime70ms/pointPatternRecognitionAccuracy+0.37umLeadLocatorDetection12ms/lead(3leads/frame)LeadLocatorAccuracy+2.4umPostBondInspectionFirstBond,Secon

8、dBondWireTracingMax.DieLevelDifferent400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II)EagleMaterialHandlingSystemIndexingSpeed200–250ms@0.5“pitchIndexerResolution1umLeadframePositionAccu