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1、GeneralThermalForceModelwithExperimentalStudiesJingLeeDepartmentofElectronicEngineeringSouthernTaiwanUniversityofTechnologyTainan,Taiwan701,R.O.C.Email:leejing@mail.stut.edu.twAbstractThermalforcehasproventobeausefulconceptformanagingthepackage-levelthermalplacementprob
2、lem.However,thepreviousthermalforcemodelisbasedoninsulatededgeboundarycondition,thusitisonlysuitabletoface-cooledpackages.Ageneralthermalforcemodelisproposedtoextendtheapplicabilityofthethermalforcetocovergeneralcoolingconditionsbyintroducingtheconceptoftheheattranspare
3、ncyofaboundary,.Bymanaging,thepresentmethodgeneratesaseriesofthermal-force-equilibriumplacementsfittingtosituationsfromface-cooledtoedge-cooledpackages.Experimentalresultsindicatethatforgeneratingthereliability-bestplacementsthebest’sareintherangeforface-cooledpackagesa
4、ndintherangeforthevolumetric-cooledpackages.Foredge-cooledpackages,thebest’sarethelargestvaluesofthatcanachieveconvergentthermal-force-equilibriumplacements.IndexTerms—Force-directedalgorithm,reliability,thermalforce,thermalplacement.I.INTRODUCTIONPlacementistheprocesso
5、farrangingcircuitcomponentsonalayoutsurfacesuchthatmultiple,possiblyconflicting,designobjectivescanbesatisfied[1].Historically,placementtechniqueshavebeendevelopedprimarilyonthebasisofroutability.Sherwani[2]providesasummaryoftheclassictechniques.Butwiththeincreasingdema
6、ndforhighqualityandreliableperformanceovertime,techniquestoaddressplacementforreliability,whichisknownasthethermalplacementproblem,becomenecessary[3],[4].28TCPT-2004-031.R1Thethermalplacementproblemoccursatthreedifferentlevels:system-level,board-level,andpackage-level.A
7、tsystem-level,theplacementproblemistoplaceallthesubsystemstogethersothatthevolumeoccupiedisminimized.Atthesametime,theheatdissipatedbyeachofthesubsystemsshouldbecooledproperlysothatthesystemdoesnotmalfunctionduetooverheatingofsomecomponents.Atboard-level,allthechipsonab
8、oardalongwithothersolid-statedeviceshavetobeplacedwithinafixedareaofthePCBsuchthatthesystemreliabilityisoptimi
