印制电路基材词汇讲解

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1、印制电路基材词汇讲解鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶В鏀惰棌鍒癐E鏀惰棌澶?鏀惰棌鍒版闈?璁句负棣栭〉鎮ㄥ綋鍓嶄负娓稿鐘舵€侊紝鐧诲綍鎴栨敞鍐屻€傜綉绔欏湴鍥炬渶鏂颁緵搴?鎴蜂富锛歴mt163鏀惰棌娓稿鐧诲綍

2、娉ㄥ唽闂ㄦ埛棣栭〉渚涙眰淇℃伅琛屼笟璧勮鎶€鏈氦娴?浜у搧涓績浜屾墜璁惧閰嶄欢鏈嶅姟姹傝亴鎷涜仒涓撲笟涔﹀簵浼佷笟搴?鎶€鏈鍧?鐑棬鍏抽敭瀛?鐑棬鍏抽敭璇嶏細SMT銆€璐寸墖鏈?SMT璁哄潧琛ㄩ潰璐磋鎶€鏈?SMT鎶€鏈?瀵艰埅鐜板湪浣嶇疆锛氶椤?>>鍩虹鐭ヨ瘑>>鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶В

3、鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶В鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶В鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶В澶у閮界煡閬擄紝鎴戜滑甯哥敤鐨凱CB鐢绘澘宸ュ叿閮芥槸澶栧浗宸ョ▼甯堢爺绌跺嚭鏉ョ殑锛屾墍浠ラ噷闈㈠嚑涔庨兘鏄嫳鏂囧崟璇嶏紝铏界劧鏈変簺宸ュ叿杞欢琚炕璇戞垚涓枃锛屼絾鎺屾彙杩欎簺甯哥敤鐨勫嵃鍒剁數璺瘝姹囪繕鏄ぇ鏈夊ソ澶勭殑銆?涓嬮潰鎴戜滑鏉ヤ粙缁嶄笅锛?1銆佸熀鏉愶細basematerial2銆佸眰鍘嬫澘锛歭aminate3銆佽閲戝睘绠斿熀鏉愶細metal-cladbadematerial4銆佽閾滅當灞傚帇鏉匡細cop

4、per-cladlaminate(CCL)5銆佸崟闈㈣閾滅當灞傚帇鏉匡細single-sidedcopper-cladlaminate6銆佸弻闈㈣閾滅當灞傚帇鏉匡細double-sidedcopper-cladlaminate7銆佸鍚堝眰鍘嬫澘锛歝ompositelaminate8銆佽杽灞傚帇鏉匡細thinlaminate9銆侀噾灞炶姱瑕嗛摐绠斿眰鍘嬫澘锛歮etalcorecopper-cladlaminate10銆侀噾灞炲熀瑕嗛摐灞傚帇鏉匡細metalbasecopper-cladlaminate11銆佹尃鎬ц閾滅

5、當缁濈紭钖勮啘锛歠lexiblecopper-claddielectricfilm12銆佸熀浣撴潗鏂欙細basismaterial13銆侀娴告潗鏂欙細prepreg14銆佺矘缁撶墖锛歜ondingsheet15銆侀娴哥矘缁撶墖锛歱reimpregnatedbondingsheer16銆佺幆姘х幓鐠冨熀鏉匡細epoxyglasssubstrate17銆佸姞鎴愭硶鐢ㄥ眰鍘嬫澘锛歭aminateforadditiveprocess18銆侀鍒跺唴灞傝绠旀澘锛歮asslaminationpanel19銆佸唴灞傝姱鏉匡細core

6、material20銆佸偓鍖栨澘鏉愶細catalyzedboard,coatedcatalyzedlaminate21銆佹秱鑳跺偓鍖栧眰鍘嬫澘锛歛dhesive-coatedcatalyzedlaminate22銆佹秱鑳舵棤鍌眰鍘嬫澘锛歛dhesive-coateduncatalyzedlaminate23銆佺矘缁撳眰锛歜ondinglayer24銆佺矘缁撹啘锛歠ilmadhesive25銆佹秱鑳剁矘鍓傜粷缂樿杽鑶滐細adhesivecoateddielectricfilm26銆佹棤鏀拺鑳剁矘鍓傝啘锛歶nsupporte

7、dadhesivefilm27銆佽鐩栧眰锛歝overlayer(coverlay)28銆佸寮烘澘鏉愶細stiffenermaterial29銆侀摐绠旈潰锛歝opper-cladsurface30銆佸幓閾滅當闈細foilremovalsurface31銆佸眰鍘嬫澘闈細uncladlaminatesurface32銆佸熀鑶滈潰锛歜asefilmsurface33銆佽兌绮樺墏闈細adhesivefaec34銆佸師濮嬪厜娲侀潰锛歱latefinish35銆佺矖闈細mattfinish36銆佺旱鍚戯細lengthwised

8、irection37銆佹ā鍚戯細crosswisedirection38銆佸壀鍒囨澘锛歝uttosizepanel39銆侀厷閱涚焊璐ㄨ閾滅當鏉匡細phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)40銆佺幆姘х焊璐ㄨ閾滅當鏉匡細epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)41銆佺幆姘х幓鐠冨竷鍩鸿閾滅當鏉匡細epoxidewovenglassfabriccopper-cladla

9、minates42銆佺幆姘х幓鐠冨竷绾稿鍚堣閾滅當鏉匡細epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43銆佺幆姘х幓鐠冨竷鐜荤拑绾ょ淮澶嶅悎瑕嗛摐绠旀澘锛歟poxidenonwoven/wovengla