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ID:41493096
大小:78.72 KB
页数:9页
时间:2019-08-26
《印制电路词汇》由会员上传分享,免费在线阅读,更多相关内容在工程资料-天天文库。
1、印制电路词汇1.综合词汇Printedcircuit印制电路Printedwiring印制线路Printedcircuitboard印制电路板Printedwiringboard印制线路板Printedcomponent印制元件Printedcontact印制接点Single-sidedprintedcircuitboard(SSB)单面印制电路板double-sidedprintedcircuitboard(DSB)双面印制电路板Multilayerprintedcircuitboard(MLB)多层印制电路板Rigidprintedcircuitboard刚
2、性印制电路板Flexibleprintedcircuitboard挠性印制电路板Flex-rigidprintedcircuitboard刚挠结合卬制电路板Build-upprintedboard积层印制板Surfacelaminai*circuit(SLC)表面层合电路板Build-upmultilayerprintedBoard(BUM)积层多层印制板Metalbaseprintedboard金属基印制板B2itprintedboard埋入凸块互连印制板ALIVHMultilayerprintedboard层间全内导通多层印制板Chiponboard(COB
3、)载芯片板Backplane背板Bareboard裸板Break-awaypanel可断拼板Interconnection互连Conductortraceline导线Substrate基底Realestate基板面Conductorside导线面Componentside元件面Solderside焊接而Printing印制grid网格pattern图形Conductivepattern导电图形Non・conductivepattern非导电图形Legend字符Mark标志2.基材2.1基材的种类和结构Basematerial基材Laminate层压板Copper
4、-cladlaminate(CCL)覆铜箔层压板Prepreg预浸材料Bondingsheet粘结片bondinglayer粘结层Preimpregnatedbondingsheet预浸粘结片Epoxyglasssubstrate环氧玻璃基板Copper-cladsurface铜箔面Foilremovalsurface去铜箔面Lengthwisedirection纵向crosswisedirection横向Corematerial内层芯材UVblockingcopper-cladlaminates紫外光阻挡型覆铜箔板2.2基材的材料A-slagcresinA阶树
5、脂B-stagcresinB阶树脂C-stageresinC阶树脂epoxyresin环氧树脂Polymer聚合物Photosensitiveresin感光性树脂Thermosettingresin热固性树脂Thermoplasticresin热塑性树脂Adhesive胶粘剂Curingagent固化剂Flameretardant阻燃剂opaquer遮光剂Polyesterfilm(PET)聚酯薄膜Polyimidefilm(PI)聚酰亚胺薄膜Polytetrafluoroethylene(PTFE)聚四氟乙烯Non-wovenfabric非织布/无纺布Glas
6、sfiber玻璃纤维Glassfabric玻璃布Warp-wise经向Weft-wise纬向Copperfoil铜箔Electrodepositedcopperfoil电解铜箔Rolledcopperfoil压延铜箔Resincoatedcopperfoil(RCC)涂树脂铜箔ReversedTreatmentFoil翻转处理铜箔DoubleTreatedFoil双血处理铜箔DrumSide/shinyside(铜箔)光面MatteSide(铜箔)毛面2.3基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性creep蠕变G
7、el凝胶体Clad覆箔Layup叠层laminating层丿虫/复合Internalidentificationmark内部识别标志Postcure后固化Geltime凝胶时间Curingtime固化时间Resinflow树脂流动度Resincontent树脂含量3设计3.1通用术语Computer-aideddesign(CAD)计算机辅助设计Computer-aidedmanufacturing(CAM)计算机辅助制造Routing布线Layout布图设计Componentdensity元件密度Array阵列3.2形状与尺寸Conductor导线Conduc
8、torwidth导线宽度
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