光刻胶工序原理及其控制要点(Photolithography)课件.ppt

《光刻胶工序原理及其控制要点(Photolithography)课件.ppt》由会员上传分享，免费在线阅读，更多相关内容在教育资源-天天文库。

1、PhotolithographyUnderstandingmoreabouttheprocessPreparedBy:NesterContentPhotolithographyIntroductionPhotoResistPropertyAlignment&ExposureTechnologyPhotolithographyIntroductionPhotolithography(Background)PCB(印刷电路板)IC(可编程芯片)CPUPhotolithography(Background)CPUWaferICWaferPhotoProcessWhatisthepurpo

2、seofPhotolithography?Thepurposeofphotolithographyistotransferimagesfromamasktothesurfaceofaproductinordertolaydownspecificareaswhichformthedesignrequirementtomakethepattern.LaminationMechanism124351Description:DryResistFilm.HotRollerPressKeyParameters:1.RollerTemperature.2.RollerSpeed3.RollerP

3、ressureResistcoatingMechanismKeyParameters:RotationSpeedConsumption(N2press)DispensersolidificationSpin-coatParticleControlPhotoResistDryResistReactionMechanismWetResistReactionMechanismPAC:Photoactivecompound(感光剂)Polyester(酚醛树脂)Photoacidgenerator(溶解促进剂)AfterDevelopment(显影)Exposure(曝光)Photores

4、istSolventsComponentsOfDNQResistPhotoactiveCompound(PAC)=DNQChemicallyreactionduringlithographyVerylowvolatilityResinandSpeedEnhancers(树脂)PrimarycomponentsaftersoftbakeVerylowvolatilitySolventDissolvesresinandPACVolatileAdditivesAdhesionpromotersPACModel(DNQ)羧基(-C00H)PACExposedChemicalreaction

5、PhotoresistNonExposedExposedhvNovolackpolymerPolymer＋ＰＡＣPolymer＋PhotocompoundNonexposedFastSlowdissolutionrate[µm/min]ＲｍｉｎＲｍａｘAcceleratedDissolutionratio!！ChemicalreactionofDNQchemistryDissolutioncharacterchangeduringlithographystepEffectOfDeveloperTemperatureAZ®7800Photoresist(1.09µmthick)SB9

6、0°C,120sec;NA0.54(conv.illume.)PEB110°C,60sec;developmentAZ®300MIF,60secDryEtchBehaviorOfNovolakResistsSelectivityVs.FluorineEtchAfteretchingCalculationMethodDryResistResolution:20um5umWetResistResistStatusAdhesion:30um5um1.Adhesion(Wet>>Dry)Relatetothesubstratesurface,Resisttype&Process2.Reso

7、lution:(CD)Dryresist:2~3umWetresist:<0.5um3.PhototonusExposureenergySoftbakingcondition4.DimensionStepper(Aligner)performanceSoft-bakingvs.Focus(AZP462015um)Alignment&Exposure光学非光学接触式接近式投影式步进式Ｘ射线电子束光刻机类型ExposureMachineCategoryContactPri