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时间:2020-06-24
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1、材料表征的方法1.ElementalAnalysis元素分析Atomicabsorptionspectroscopy原子吸收光谱Augerelectronspectroscopy(AES)俄歇电子能谱Electronprobemicroanalysis(EPMA)电子探针微分析Electronspectroscopyforchemicalanalysis(ESCA)化学分析电子能谱Energydispersivespectroscopy(EDS)能量色散谱Flamephotometry火焰光度法Wavelengthdispersivespe
2、ctroscopy(WDS)X-rayfluorescenceX射线荧光2.MolecularandSolidStateAnalysis分子与固态分析Chromatography[gaschromatography(GC),sizeexclusionchromatography(SEC)]色谱[气相色谱,体积排除色谱]Electrondiffraction电子衍射Electronmicroscopy[scanningelectronmicroscopy(SEM),transmissionelectronmicroscopy(TEM),sca
3、nningTEM(STEM)]电子显微镜Electronspinresonance(ESR)电子自旋共振Infraredspectroscopy(IR)红外光谱Massspectrometry质谱Mercuryporosimetry压汞法Mossbauerspectroscopy穆斯堡尔谱Nuclearmagneticresonance(NMR)核磁共振Neutrondiffraction中子衍射Opticalmicroscopy光学显微镜Opticalrotatorydispersion(ORD)旋光色散Ramanspectroscopy
4、拉曼光谱Rutherfordbackscattering(RBS)卢瑟福背散射Smallanglex-rayscattering(SAXS)小角X射线散射Thermalanalysis[differentialscanningcalorimetry(DSC),thermalgravimetricanalysis(TGA),differentialthermalanalysis(DTA)temperaturedesorptionspectroscopy(TDS),thermomechanicalanalysis(TMA)]热分析[差示扫描量热
5、计法,热-重分析,微分热分析,升温脱附,热机械分析]UVspectroscopy紫外光谱X-raytechniques[x-rayphotoelectronspectroscopy(XPS),x-raydiffraction(XRD),x-rayemission,x-rayabsorption]X射线技术[x射线光电子能谱,x射线衍射,x射线发射,x射线吸收]3.SurfaceCharacterizationTechniques表面表征技术Electronenergylossspectroscopy(EELS)电子能量损失谱Ellipsom
6、etry椭圆偏振术Extendedx-rayabsorptionfinestructure(EXAFS)扩展X射线吸收精细结构Helium(oratom)diffractionLateral(orfrictional)forcemicroscopy(LFM)横向(摩擦)力显微镜Low-energyelectrondiffraction(LEED)低能电子衍射Magneticforcemicroscopy(MFM)磁力显微镜Near-edgex-rayadsorptionfinestructure(NEXAFS)近边X射线吸收精细结构Near
7、fieldscanning近场扫描Reflectionhigh-energyelectrondiffraction(RHEED)反射高能电子衍射Scanningtunnelingmicroscopy(STM)扫描隧道显微镜Scanningforcemicroscopy(SFM)扫描力显微镜Secondaryionmassspectroscopy(SIMS)二次离子质谱Surfaceenhancedramanspectroscopy(SERS)表面增强拉曼光谱Surfaceextendedx-rayadsorptionfinestructur
8、e(SEXAFS)表面扩展X射线吸收精细结构Surfaceforceapparatus表面力仪器
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