印刷线路板相关资料

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1、ULstandardsforPWBcertification:印刷电路板审核所使用的UL标准：oUL796Printed-WiringBoardsUL796印刷线路板标准oUL94TestsforFlammabilityofPlasticMaterialsforPartsinDevicesandAppliancesUL94燃烧测试标准oUL746EPolymericMaterials-IndustrialLaminates,FilamentWoundTubing,VulcanizedFibre,andMaterialsUsedinPrintedWiring

2、BoardsUL746E印刷线路板基材认证标准oUL746FPolymericMaterials-FlexibleDielectricFilmMaterialsForUseInPrinted-WiringBoardsandFlexibleMaterialsInterconnectConstructionsUL746F柔性印刷线路板材认证标准Common-usedGLOSSARYofPWB常用的印刷线路板专业术语2.1BASEMATERIAL：Aninsulator,consistingoforganicorinorganicmaterialthatsupp

3、ortsapatternofconductivematerial.基材：一种绝缘体，由有机或者无机的材料组成，是导体材料的载体。2.2BUILD-UPTHICKNESS：Overallthicknessofacombinationofmaterials.Unlessotherwiseindicated,thebuild-upthicknesswillrefertotheoverallthicknessofaboardconstructionwherenointernalorexternalconductormaterialresides.压合厚度：各种材料

4、厚度的总和。除非另外的说明，压合厚度是不包括内层，外层铜箔厚度的总厚度。2.3SINGLELAYERBOARD：APWBwithonlyonelayerlaminate,mayincludesinglesidedcopperanddoublesidedcopper.AndinUL,wedifferentiatethemintosinglelayersinglesidedandsinglelayerdoublesided.单层板：只有一层基材的印刷线路板,可包含单面铜箔或者双面铜箔。在UL,我们会区分单层单面板和单层双面板。2.4EDGECONDUCTOR–

5、Aconductorparallelwithandspacednotmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.边缘导体－导体的边缘与板边的距离在0.4mm的范围内。请参考下图。AA：导体的边缘与板边的距离在0～0.4mm之间，且不可以切到铜箔。42.5IMMERSIONSILVER：Consistsofaverythincoatingtypicallylessthan0.55microns(0.0217mils)ofnearlypuresilvercreatedbygalvanicdi

6、splacementandmaycontainaslightamountoforganicmaterialdepositedwiththesilver.浸银：由很薄的（小于0.55微米）接近纯银的涂层组成。纯银通常由置换产生，可能会含有少量的沉积的有机物。2.6MAXIMUMOPERATIONTEMPERATURE：Themaximumtemperaturetheboardwillbeexposedtointheendproductduringoperatingconditions.最高工作温度：在连续作业的情况下，成品所能承受的最高温度。2.7MIDBO

7、ARDCONDUCTOR：Aconductorspacedmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.DifferentwiththeEdgeConductor.中部导体：边缘距板边大于0.4mm的导体。区别于边缘导体。2.8DELAMINATION：Aplanarseparationofmaterials(i.e.separationbetweenconductorandbasematerial,prepreg,dielectricmaterial,etc.).分层：材料之间的分离（如

8、：导体与基材之间，导体与半固化片，以及绝缘层之间的分离，等等）。2