LED封装EMC支架制程.pdf

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1、2011/09/07Pre-moldEpoxyLFProcessIntroductionETCHINGFrameSilverPLATINGStripCUTTING蝕刻電鍍切片DEFLASHPostMoldCURETransferMOLD除膠成型烘烤杯體注膠ETCHING&PLATINGRTREtchingProcessPlatingProcessProcessesCuttingMoldingPMCDe-flash除膠LEDAssemblyProcessesDieBondWireBond切割分bin點膠No.ofLEDPackagesperSet

2、forTVsDrivingforhigherpower,brightness,efficacyMaximizingOpticalPerformance●PackagedesignReflectorcupgeometry●LeadframePlatingbrightness(GAM)●ReflectorcupMaterialSelectionReflectorCupGeometryDesignCombinedEffectOfCupHeightAndSideWallAngle-Shallowercupheightandlargersidewalla

3、nglegivehighertotalfluxPhosphorConcentration-NeedhigherphosphorconcentrationtokeepsameCIELeadFrameAg-PlatingBrightness-Thehighertheplatingbrightness,theclosertomirrorsurface,thehigherthelightintensity-TypicallyquantifiedasGAMvalueEMCandSMCSelectionForPackageReflectorWhatAreC

4、WTC’sAdvantages●ETCHING–ReeltoReeletchingprocessavailableHigherproductivity●PLATING–DoublesideAgplating+AgflashcapabilityHigherAg-platingbrightness●MOLDING–Morethan20yearsexperienceinICfieldEnsuremoldingqualityandperformance●PMC–Morethan20yearsexperienceinICfieldWellcontrolL

5、/Fstripwarpage●DEFLASHING–Besttech.fromICassemblyexperienceWellcontroldeflashperformanceforpost-processes