LTCC射频模块设计(HFSS).pdf

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1、DesignofLTCCRFModulesforDesignofLTCCRFModulesforCommunicationsystemsCommunicationsystemsEmpoweringProfitabilityHF/SIworkshopAgenda®LTCCBackground®OverviewofLTCCRFModuleandconsiderations®ChallengesinLTCCRFModuledesign®AnsoftLTCCsolution®EmbeddedPassivesModeling®PAMModuledesign®CouplerModuledesi

2、gn®SwitchModuledesign®SummaryLTCCBackground®WhatisLTCC?-LTCCisaProcessTechnologywhichallowsRFengineerstocreatePassivecomponentsintheLTCCsubstrate®LTCC(LowTemperatureCeramicCofired)-SilverandGoldmetalalloysareprintedontoselectedlayersofthesubstrate-Eachlayerisaceramiccompositewithverystablediel

3、ectricproperties-Complimentssiliconintegrationwithembeddedpassives-Ceramictechnologycircuitelementssuchascapacitorsresistors&inductors-Low-Temperatureprocessallowsfortheuseofhighlyconductivemetals(AG,AU)LTCCModulestructureTransistorBareChipLTCCBuriedInductorBuriedCapacitorBuriedInductorResisto

4、rChipCapacitorMonoliticICInternalElectrodeSurfaceElectrodeLTCCManufacturingprocessPackageStyles®Castellated®-Mostrecentdevelopment®-BestRFperformance®-Lowestcost®Cliplead®-BackwardCliplead®-Backwardcompatible®-Goodmechanicalstrength®-Mediumcost®BGA®-Standardfootprint®-Goodmechanicalstrength®-M

5、ediumcostLTCCMaterialsSubstrate&PackageDielectricCompanyTangentδModelconstant7.80.0063951Dupont7.50.0029435.9A6MFerro0.00125.9A6S7.680.0039CT800Heraeus9.150.0027CT20005.6~5.7GL550Kyocera-9.4~9.5GL660LTCCConsiderations-Vias-®Viasizes®-Viasizesare150µm,200µmand250µm,aspunchedtotheunfiredtape.®-V

6、iadiameterisrecommendedtobeclosetotherapethickness.®-Oneviadiameteronanytapelayerrecommended.®Catchpads®-Alineconnectiontoavialessthan250µmindiametershallhavearoundcatchpad50µmlargerthantheviadiameter®Viaspacing®-Minimumviatoviapitch(centertocenter)withinthesametapelayershallbe2.5xviadiameter.

7、®-Minimumviastaggerbetweentapelayersshallbe2xviadiameter.®-Minimumviacentertopartedgedistanceshallbe3xviadiameter.LTCCConsiderations-Vias-®Stackedvias®-Stackingofviasisacceptablethroughanynumberoflayers.®-Astackedviaconnectionresultsina