ACF材料简要介紹.ppt

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1、周驊JI工程2課ACF材料介紹目錄WhatisACFACF之應用ACF材料介紹ACF與COG製程參數之關係ACF與COG製程品質之關係WhatisACF一.異方性導電膠AnisotropicConductiveFilm二.佈滿導電粒子之熱硬化樹脂膠帶三.提供特定方向之導電功能四.具有良好之接著效果ACF之應用PCBPanelChipGlassPCBPanelFPCGlassFPCPCBFPCGlassCOFPCBCOFCOFChipCOFACF材料介紹(forFPC)AC-7106U-25TypeofSeparaterACF厚度1000mm10=1

2、00mmFPCminPitch一.FPCminspace:50μm二.FPCminwidth:50μm三.ConnectionResistance:2四.IsulationResistance:10^12PanelFPCwidthspaceACF材料介紹(forFPC:7106)五.厚度:25μm(取決於FPC導線之高度,請見續頁詳述)六.長度:50M七.寬度:2.5mm(取決於FPC壓著區域之寬度)八.粒子大小:10μm九.粒子密度:800pcs/mm^2十.接著劑:熱硬化樹脂十一.Separater:防靜電PETAuNiPlasticP

3、articleACF材料介紹(forFPC:7106)十二.ACF厚度與FPC的關係W:conductorwidthS:conductorspaceH:conductorheightT0:ACFthicknessbeforebondingT1:ACFthicknessafterbonding:correctionvalue(0.15H)FPCT0HSWPanelPanelFPCT1(W+S)*T0=H*S+T1*(W+S)ifW=ST0=H/2+T1+ACF材料介紹(forCOG:8304)一.厚度:23μm(取決於ICBump之高度,請見續頁

4、詳述)二.長度:50M三.寬度:2.5mm(取決於IC之寬度)四.粒子大小:5μm五.粒子密度:20000pcs/mm^2六.接著劑:熱硬化樹脂七.Separater:防靜電PET八.DoublelayerAuNiPlasticParticleACF與COG製程參數之關係8642002505007501000Time(hr)Connectionresistance()170C190C210C10secBonding8642002505007501000Time(hr)Connectionresistance()190C210C230

5、C一.製程溫度時間接觸阻抗5secBonding190C210C85C,85%RHACF與COG製程參數之關係Connectionresistance()8642002505007501000Time(hr)二.製程壓力接觸阻抗25MPa50MPa100MPa200MPa250MPa50~150MPa85C,85%RHACF與COG製程品質之關係Connectionresistance()86420051015Numberofparticle(perBump)一.導電粒子數接觸阻抗86420051015t=0hrt=500hrs-40

6、C100C每個goldbump導電粒子數須大於5顆ACF與COG製程品質之關係二.導電粒子變形量接觸阻抗Connectionresistance()Deformation(%)86420020406080t0=5μmtBumpBumpGlassGlassDeformation=t0-tt0100%每個導電粒子壓著變形量須大於20%ACF與COG製程品質之關係三.導電粒子變形量判別標準ACF與COG製程品質之關係四.ACF厚度接觸阻抗Connectionresistance()86420ACFThickness(μm)86420152025

7、30t=0hrt=500hrs-40C100C15202530ACFThicknessBumpheight+3μm18μmBumpheight:15μmACF與COG製程品質之關係五.Bumphardness接觸阻抗Connectionresistance()Time(hr)15~25Hv40~50Hv100~110Hv8642002505007501000Bumphardness50Hv85C,85%RH100~110Hv40~50Hv15~25Hv導電粒子未壓破變形導電粒子變形量20%導電粒子變形量50%ACF與COG製程品質之

8、關係六.Bumppad導電粒子數導電粒子密度Numberofconductingparticlesonabump30201