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1、IGBTModulesforelectricalvehicleNorbertPluschke,SemikronHongKongNorbertPluschke,SemikronHongKong08.03.20121-No“longtime”experienceinthisfield-No“information”aboutFITandMTBFDevelopmentofIGBTChips–chipisgettingsmallerSince20yearsisthishousinginoperationStandardIGBTmodulewithbaseplateSEMITRANSFailur
2、eInformationFailurereasonFailureratekeepIGBT------cold!!StandardConstructionofpowerModuleThermalpasteHeatsinkWateroraircooledLifetimeproblemsAttritionDifferentMaterialwillgeneratedifferentexpansionPowerIGBTModulesforElectricalVehicle-Nobaseplate-nosolderlayer-nosolderedpins(springcontact)-homoge
3、neouspowerterminals-baseplate-solderlayer-solderedpins-inhomogeneouspowerterminalsComparisonofconnectionsinpowermodules1,21,2110,80,870%0,60,60,40,40,220%0,2%ofmeltingtemperature%ofmeltingtemperature00meltingoperationmeltingoperationSteelSolderedPowerModulesSolderSteel1,210,80,60,4Thesinterinter
4、connect16%0,2eliminatestheweakest%ofmeltingtemperature0InterfacemeltingoperationSinteredPowerSinterModules10Thesolderproblem;operatingtemperatureThedifferencebetweensoldertemperatureandIGBTjunctiontemperaturemustbereliable–-----------20-40°CarenotenoughMeltingtemperatureIGBTchip=220°CT=175°Cjmax
5、Solderlayerdifficulties100Homologoustemperatureexpressesthetemperatureofamaterialasafractionofitsmeltingpointtemperatureusing80theKelvinscale.Forexample,thehomologoustemperatureofleadatroomtemperature(25degree)60isapproximately.50(TH=T/Tmp=298K/601K=.50).Ruleofthumb40OperatingmeltingTemperature≤
6、temperature/220homologoustemperature[%]Operationtemperature/Solidustemperature(meltingpoint)0SnAg(3,5)AuGe(3)AgsinterlayermaterialSnAg(3,5)AuGe(3)Agsinterlayersolidustemperature[°C]221363961<40%:consideredmechanicalstablesolidustemperature[K]494636123440-60%:creeprange,sensitivetostrainoperation
7、temperature[°C]150150150operationtemperature[K]423423423>60%:unabletobearengineeringloadshomologoustemperature[%]866734avoidsolderconnectionsforautomotiveapplicationThesolderproblem;operatingtemperatureMeltingtemperatures