asm自动焊线机器介绍auwirebondingprocess.ppt

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1、Section9.3BasicAuWireBondProcess8/18/20211ASMPacificTechnologyLtd.©2009ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality8/18/20212ASMPacificTechnologyLtd.©2009BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBonding

2、Introduction8/18/20213ASMPacificTechnologyLtd.©2009Cross-sectionofanICPackageDieGoldWireLeadFrame8/18/20214ASMPacificTechnologyLtd.©2009WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPackingICMa

3、nufacturingFlowDejunkTrimSolderPlatingSolderPlatingForming/SingulationTrim/FormingBGASURFACEMOUNTPKGTHROUGHHOLEPKG8/18/20215ASMPacificTechnologyLtd.©2009GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)8/18/20216ASMPacificTechnologyLtd.©200

4、9WedgeBonding8/18/20217ASMPacificTechnologyLtd.©2009WhattechniqueisusedinGoldWireBonding?8/18/20218ASMPacificTechnologyLtd.©2009WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,and

5、ball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.8/18/20219ASMPacificTechnologyLtd.©2009ThermocompressionvsThermosonicThermocompr

6、essionweldingusuallyrequiresinterfacialtemperatureoftheorderof>300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,w

7、hichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.8/18/202110ASMPacificTechnologyLtd.©2009AdvantagesofThermosonicMetallurgicaljoiningismorereliabletha

8、nconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.8/18/202111ASMPacificTechnologyLtd.©2009WirebondingO