倒装焊工艺(bumping).pdf

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1、BUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBumpingprocessintroductionDomesticBumpingindustryReflowmachineBumpingprocessintroductionWaferbumping:plantingballonwaferpadApplication:advancedpackage(BGA&WLP&CSP…..)Waferbumps-goldbums-solderbumps-platingbumps-stencilprintingbumps

2、-solderballattachBumpingprocessintroductionMethodsofwaferbumpingforflipchip
Goldbumping(plated)
Solderbumping(plated)
Goldball(stud)bumps(goldwiremicroweld)
Solderballbumpsplacement
StencilPrintedsolderbumpingBumpingprocessintroductionSolderbumpingprocessisaccomplished

3、inafoundry-likeprocessingsetting.Thebumpsaregenerallymadeoflead,tin,oracombinationofboth.SolderBumpingprocessflowBumpingprocessintroduction•goldballbumpingistrulyanextensionofthewirebondingprocess.Wirebonding.Gold(stud)bumpsBumpingprocessintroductionStencilprintedsolde

4、rbumpingBumpingprocessintroductionSolderballbumpsplacementandreflowBumpingprocessintroductionCostsofgoldballbumpingvs.platingDomesticBumpingindustry
苏州颀中Chipmore
上海宏茂Chipmos
上海安靠Amkor
星科金朋SCC
江阴长电JCAP
苏州晶方WLCSP
中芯国际SMICDomesticBumpingindustry上海宏茂Chipmos&苏州欣中Chipmore-TC

5、P&COG&COFforLCDDriverIC-Goldbumps上海安靠Amkor-putintoproduction-gold&solderbumping星科金朋SCC-BumpingservicefromTSMC-Gold+Nibumping&solderbumpingDomesticBumpingindustry•JCAPBumpingServicesDomesticBumpingindustry苏州Shellcase-ShellcaseWLCSPprocess&Waferbumpingprocess&TSVWLCSPpro

6、cessReflowmachine氮气回流焊炉(forWAFERBUMPFORMING)---YAMATOWORKS(120000USD)ReflowmachineHELLER1800EXL系列回流焊炉(((深圳敏科）Reflowmachine大型全热风无铅回流焊炉---SNR-SNRSNR-SNR---845P845P（（苏（苏苏州圣苏州圣岗岗）岗）大型全热风无铅回流焊炉ReflowmachineSEMIgearGENVEASTP200/300Reflowmachine