日本电气化学(Denka)散热铝基板中文介绍

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1、InsulatedMetalSubstrateHITTPLATE绝缘高导热铝基板DENKIKAGAKUKOGYOK.K.日本电气化学工业有限公司DENKAQQ:7912431613510124300ThefieldsuitableforHybridIC适用与混合集成电路领域.Audio音频PowerAMP.功率放大器Pre-AMP.前置放大器Motordriver马达驱动器Transistor晶体管Inverter换流器Micro-stripcircuit微带型混频器Oscillator振荡器Regula

2、tor调节器EPS应急电源装置Powermodule电源模块ＨＩＴＴＰＬＡＴＥ高导热铝基板(IMS)标准SWregulator开关调节器DC/DCConverter直流/直流转化器LED发光二极管CPUboard中央处理器主板Powersupply电源供应器VTR,TV磁带录像机,电视Tuner调谐器Regulator调节器SuitablefieldforIMSTheMotorregulator马达调节器Automotive汽车NewUsage新应用Communication通讯Highfrequency

3、AMP高频放大器Computer电脑PowerElectronics动力电子设备PowerSupply电源供应器适用于工业管理学会Classificationofprintedcircuitboard印刷线路板的分类Ceramicsubstrate陶瓷基片InsulatedMetalSubstrate绝缘金属基材Substratewiththickfilmcircuit.厚膜陶瓷线路板Substratewiththincircuit.薄膜陶瓷线路板SubstrateMulti-layer多层陶瓷线路板Me

4、talBaseSubstrate(Al,Cu,Fe)金属基材(铝,铜,铁)MetalCoreSubstrate(Al,Cu,Fe)金属芯基材(铝,铜,铁)MetalBaseSubstratewithMulti-Layer(FR-4)多层环氧树脂金属基材Paperbasedmaterial(phenol)纸基板(酚基材)Glassclothbasedmaterial(epoxy,polyimide)玻璃基材（环氧树脂，聚酰亚胺）Rigidsubstrate刚性基板Organicsubstrate有机基板Fle

5、xiublesubstrate柔性基板eComposite(combinationwithdifferentmaterials)复合材料（与不同的材料结合）Thermoplasticresin热塑性树脂Filmmaterial(polyimide,polyester)薄膜材料（聚酰亚胺，聚酯）*AlbasetypeEvaluateitem评估项目Insulatedmetalsubstrate绝缘金属基材Aluminasubstrate铝基材Glass-epoxysubstrate玻璃环氧树脂基材Ther

6、malresistanceºC/W热变电阻0.6(80um)0.7(635um)3.41.6mmBreakdownvoltage击穿电压○◎◎Heatresistance耐热性○◎○Dielectricconstant介电常数7-894-5Specificheat比热系数0.280.370.19Mechanicalstrength机械强度◎X○Processing制程◎X○Massprocess量产性○△○基本类型Comparisonofpropertieswitheachsubstrate每种基材的性能对

7、照TypicalstructureofIMS标准层的典型结构Conductor(Cufoil,etc.)导体（铜箔等）Insulator绝缘层MetalBase（Al,Cu,Fe,etc.)金属基材（铝，铜，铁等）TypicalstructureofHIC典型的混合集成电路结构Niplating镍层Alwire铝丝Plasticcase塑胶外壳Semiconductor半导体Chipresistance贴片电阻Resin树脂Leadterminal引线端子Insulator绝缘层Aluminumb

8、oard铝板IMS标准层DevelopmentperformanceofIMS标准层的发展方向ImprovementofInsulator绝缘层的改善→Higherthermalconductivity,higherreliabilityandhigherheatresistance.更高的导热系数，高可靠性和高耐热性.Fieldofeachsubstrate每种基材的领域Industrialmachine工业