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ID:47115703
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页数:9页
时间:2019-08-06
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1、1、CPU3DNow!(3Dnowaiting)ALU(ArithmeticLogicUnit,算术逻辑单元)AGU(AddressGenerationUnits,地址产成单元)BGA(BallGridArray,球状矩阵排列)BHT(branchpredictiontable,分支预测表)BPU(BranchProcessingUnit,分支处理单元)BrachPediction(分支预测)CMOS(ComplementaryMetalOxideSemiconductor,互补金属氧化物半导体)CISC(Compl
2、exInstructionSetComputing,复杂指令集计算机)CLK(ClockCycle,时钟周期)COB(Cacheonboard,板上集成缓存)COD(CacheonDie,芯片内集成缓存)CPGA(CeramicPinGridArray,陶瓷针型栅格数组)CPU(CenterProcessingUnit,中央处理器)DataForwarding(数据前送)Decode(指令译码)DIB(DualIndependentBus,双独立总线)EC(EmbeddedController,嵌入式控制器)Embe
3、ddedChips(嵌入式处理器)EPIC(explicitlyparallelinstructioncode,并行指令代码)FADD(FloationgPointAddition,浮点加)FCPGA(FlipChipPinGridArray,反转芯片针脚栅格数组)FDIV(FloationgPointDivide,浮点除)FEMMS(FastEntry/ExitMultimediaState,快速进入/退出多媒体状态)FFT(fastFouriertransform,快速热奥姆转换)FID(FID:Frequenc
4、yidentify,频率鉴别号码)FIFO(FirstInputFirstOutput,先入先出队列)flip-chip(芯片反转)FLOP(FloatingPointOperationsPerSecond,浮点操作/秒)FMUL(FloationgPointMultiplication,浮点乘)FPU(FloatPointUnit,浮点运算单元)FSUB(FloationgPointSubtraction,浮点减)HL-PBGA(表面黏着,高耐热、轻薄型塑料球状矩阵封装)IA(IntelArchitecture,英
5、特尔架构)ICU(InstructionControlUnit,指令控制单元)ID(identify,鉴别号码)IDF(IntelDeveloperForum,英特尔开发者论坛)IEU(IntegerExecutionUnits,整数执行单元)IMM(IntelMobileModule,英特尔移动模块)InstructionsCache(指令缓存)InstructionColoring(指令分类)IPC(InstructionsPerClockCycle,指令/时钟周期)ISA(instructionsetarchi
6、tecture,指令集架构)KNI(KatmaiNewInstructions,Katmai新指令集,即SSE)Latency(潜伏期)LDT(LightningDataTransport,闪电数据传输总线)LocalInterconnect(局域互连)MESI(Modified,Exclusive,Shared,Invalid:修改、排除、共享、废弃)MMX(MultiMediaExtensions,多媒体扩展指令集)MMU(MultimediaUnit,多媒体单元)MFLOPS(MillionFloationgP
7、oint/Second,每秒百万个浮点操作)MHz(MillionHertz,兆赫兹)MP(Multi-Processing,多重处理器架构)MPS(MultiProcessorSpecification,多重处理器规范)MSRs(Model-SpecificRegisters,特别模块寄存器)NAOC(no-accountOverClock,无效超频)NI(Non-Intel,非英特尔)OLGA(OrganicLandGridArray,基板栅格数组)OoO(OutofOrder,乱序执行)PGA(Pin-Grid
8、Array,引脚网格数组,耗电大)PR(PerformanceRate,性能比率)PSN(ProcessorSerialnumbers,处理器序列号)PIB(ProcessorInaBox,盒装处理器)PPGA(PlasticPinGridArray,塑料针状矩阵封装)PQFP(PlasticQuadFlatPackage,塑料方块平面封装)R
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