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1、SEMIP28-96N/A©SEMI1996SPECIFICATIONFOROVERLAY-METROLOGYTESTPATTERNSFORINTEGRATED-CIRCUITMANUFACTURE1Purpose4.2ASTMStandard1ThisdocumentdefinesseveralstandardoverlayF127-84—DefinitionofTermsRelatingtoPhoto-metrologypatternswhichareusedbymetrologymaskingTechnologyforMicroelectronicsequipm
2、entuserstoevaluateandtestmicropatterningequipmentandprocessesinintegratedcircuit(IC)5Terminologymanufacturing.Theseoverlaycellsmaybeplacedby5.1centerline—Areferencelinethatisequidistantoptionalpatterningmethodsontosubstratesduringthefromoppositeedgesofafeature.manufacturingprocess.Usage
3、ofthestandardoverlaypatternsisanattempttoprovideconsistentindustry-5.2feature—Areaswithinasinglecontinuouswideuseofautomatedmetrologyequipment.boundary(forexample,anaggregateimage)thathaveanyphysicalpropertythatisdistinctfromtheback-2Scopegroundareaoutsidethefeature(e.g.,thesimplestele-
4、mentofatestpattern,suchasasinglelineorbar).ThisspecificationdefinesgeneraldesignswhichSomephysicalproperties,forexample,whichmaydis-describetheshape,size,designrulesandplacementtinguishthefeaturearetherefractiveindex,surfaceconsiderations(whereappropriate)ofseveralbasicroughness,etc.pat
5、ternsforoverlaymetrology.Thesestandardtestpat-ternscanbeusedforoptical,scanningelectronbeam,5.3featuredimension—Thedimensionofinterest,andothertypesofmetrology.suchasthesideofabox,barwidthand/orlength.5.4overlay(micropatterning)3LimitationsThepatternsdescribedinthisdocumentrepresenttheA
6、vectorquantitydefinedateverypointonthewafer.firstpassatanindustry-widecommonalityforthepur-Itisthedifference,O,betweenthevectorposition,poseofcompatibilityamongvarioustypesofauto-P,ofasubstrategeometry,andthevectorposition1matedmetrologyequipment.Itisnotsuggested,ofthecorrespondingpoint
7、,P2,inanoverlayingpattern,however,thatthesetestpatternsareeitherafullcom-whichmayconsistofphotoresist.[SEMIP18-92]plementorareoptimalforalloverlaymetrologyappli-NOTE:Alloverlaytestpatternsaredesignedtoprovidecations.ThisdocumentdoesnotattempttospecifybothXandYcomponentsofthevec