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1、SEMIE33-94N/A©SEMI1994,1996SPECIFICATIONFORSEMICONDUCTORMANUFACTURINGFACILITYELECTROMAGNETICCOMPATIBILITYNOTICE:Thisstandarddoesnotpurporttoaddress2.3CENELEC,EN55022,19872ÑModificationstosafetyproblemsassociatedwithitsuse.ItistheCISPR22responsibilityoftheuserofthisstandardtoestablish32.
2、4DraftBritishStandardEN50082-2ÑElectro-appropriatesafetyandhealthpracticesanddeterminemagneticCompatibilityÑGenericImmunityStandard:theapplicabilityofregulatorylimitationspriortotheIndustrial(CLC/TC110(Sec)44)use.2.5EmeraldBook1ÑIEEERecommendedPractice1IntroductionforPoweringandGroundin
3、gSensitiveElectronicEquipment,IEEE,19921.1PurposeÑThepurposeofthisspecificationistoassurethatsemiconductormanufacturingfacilitiesand2.6EOS/ESDAssociationAdvisoryforElectrostatictheequipmentusedformanufacturingsemiconductorDischargeTerminology4ÑGlossary,1992deviceswilloperatetogetherreli
4、ablywithoutfailures2.7FIPS(FederalInformationProcessingStandards)causedbyelectromagneticinterferenceorelectrostatic5Publication94,21September1983ÑGuidelineondischarge.Thisgoalisgenerallyknownas"electromag-ElectricalPowerforADPInstallationsneticcompatibility"orEMC.2.8IEC801-2,SecondEditi
5、on,1991-042ÑElectro-1.2ScopeÑThisspecificationappliestofacilitiesandstaticDischargeRequirementsequipmentconstructedforthepurposeofmanufacturingsemiconductordevicesincludingallfacilitiesalarm,2.9IEC801-3,FirstEdition,19842ÑRadiatedElec-safety,communicationsandcontrolsystems,processingtro
6、magneticFieldRequirementsequipment,metrologyequipment,automationequip-22.10IEC801-4,FirstEdition,1988ÑElectricalFastment,andinformationtechnologyequipment.Transient/BurstRequirements1.3LimitationsÑThisspecificationdoesnotapplyto2.11IECTC65(Sec.)137(801-5)CommitteeDraft,theequipmentandfa
7、cilitiesusedfortheassemblyand2July1992ÑSurgeImmunityRequirementsfunctionaltestingofintegratedcircuits.Thisspecifica-tiondoesnotapplytoprocess-specificchargingthat2.12IECTC65(Sec.)144(801-6)CommitteeDraft,February19922ÑImmunitytoConductedDistur-mayoccurtosemiconductorsundermanuf
