FPC_流程简介

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1、FPC制程簡介PCB事業群FPC事業處鴻勝科技富葵廠區PreparedbyJovenLeeFPC產品介紹FPC產品優點FPC產品用途FPC產品原材料FPC生產流程在電子行業中,印刷電路板大體分為P.C.B(PrintedCircuitBoard)和F.P.C(FlexiblePrintedCircuit),即硬質印刷電路板和柔性印刷電路板.而我們公司的產品屬於F.P.C這一類型.1.產品介紹2.產品優點(AdvantageofFPC)體積小SmallVolume重量輕LightWeight可折疊做3D立體安裝(Flex-to-Install)可做動態撓屈(Dynami

2、cFlexibility)產品使用之一ApplicationForNotebookHingeCableDouble-sidedFPCImpedance50560,000CyclesFlexureLifeEMIStrategyApplicationHingeCableDouble-sidedFPCImpedance50560,000CyclesFlexureLifeCardbusDouble-sidedFPC100MHzTransferSpeedTouchPadDouble-sidedFPCSMTMounting產品使用之二ApplicationForNootb

3、ook–CD/DVDROMDouble-sidedFPCStandardIDEInterfaceGroundingStrategyApplicationSingle-sidedFPCSpindleControlUnitSwitch&PhotoSensorAppliedonFPCSingle-sidedFPC60,000CyclesFlexureLifeUltraThinMaterialDesign產品使用之三ApplicationForLCDPanelLCMCableDouble-sidedFPCSMCMountingEMINoiseDepressionLCMCabl

4、eDouble-sidedFPCSMCMountingACFLaminatingonFPCLCMCableDouble-sidedFPCFinePattern(L/S=1.6/1.8mil)ACFLaminatingonFPCHDDCableDouble-sidedFPC產品使用之四ApplicationForPDASwitchBoardDouble-sidedFPCSMTMountingBatteryBoardSingle-sidedFPCSMCMountingHighCurrent-carriyngCapacity產品使用之五ApplicationForCELLU

5、LARPHONEDouble-sidedFPC100,000CyclesFlexureLifeACFLaminatingonFPCDouble-sidedFPCBattery產品使用之六ApplicationFormp3OurCustomersHITACHIConsumerCommunicationComputer廣宇科技Quanta致勝科技OthersIntelCiscoMotorolaRawMaterial-CCL相關名詞:CopperCladLaminates(銅薄基材)Single-Sided(單面銅薄基材)Double-Sided(雙面銅薄基材)Copper

6、Foil:銅箔，銅皮RA銅:壓延銅箔,輾壓方式。ED銅:電解銅箔,電鍍方式(Electrodeposited)。一盎司:即在一平方英呎的面積上，長出一盎司的銅。Polyimide(PI)聚亞醯胺:是一種由Bismaleimide與AromaticDiamine所共同聚合而成的優良樹脂,杜邦公司將之做成片材，稱為Ketpon。CoverlayAdhesiveCopperAdhesiveBaseFilmAdhesiveCopperAdhesiveCoverlayCoverlay(覆蓋膜):是由介質薄膜與背膠層所組成，用於動態軟板時，須注意軟板線路層與覆膜兩者之平衡。Die

7、lectricSubstrateAdhesiveMylarAdhesiveKaptonRawMaterial-CVL用途:1.補強軟板2.提供零件所需承載強度3.補償軟板厚度材質區分:PI/PET/FR4/SUS…結合方式:PSA:感壓型ThermalSet:熱固型ThermalPlastic:熱塑型RawMaterial-STIFFENERFR4PETPI銅箔裁切NC鑽孔黑孔鍍銅表面處理乾膜曝光顯影蝕刻AOI線檢表面處理貼覆蓋膜壓合衝孔表面處理印刷沖條貼膠電測衝型軟板檢查組裝始開束結生產工藝流程銅箔原材料(捲Reel)銅箔半成品(片Pnl)利用裁切