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1、IEEETRANSACTIONSONVERYLARGESCALEINTEGRATION(VLSI)SYSTEMS,VOL.14,NO.11,NOVEMBER20061165AnIntegratedApproachtoThermalManagementinHigh-LevelSynthesisRajarshiMukherjee,Member,IEEE,andSedaOgrenciMemik,SeniorMember,IEEEAbstract—Thermaleffectsarebecominganimportantfactorincanleadtopermanentdamagein
2、thelongrun.Inadditionthedesignofintegratedcircuitsduetotheadverseimpactoftem-tothereliabilityconcerns,thedependencyofleakagepowerperatureonperformance,reliability,leakage,andchippackagingontemperaturecreatesachallengeforlowpowerdesign.Ascosts.Makingallphasesofthedesignflowawareofthisphysicalt
3、heshareofleakageintotalbudgetsincreases,theshrinkingphenomenonhelpsinreachingfasterdesignclosure.Inthispaper,wepresentanintegratedapproachtothermalmanagementinar-shareofdynamicpowerwillactuallyleadtolessactualpowerchitecturalsynthesis.Oursynthesisflowcombinestemperature-beingutilizedforperfor
4、mance.Leakagehasanexponentialawareschedulingandbindingbasedonfeedbackfromthermaldependenceontemperature.Therefore,hightemperaturescansimulation.Weshowthatourflowiseffectiveinpreventinghotspotcausealargeshiftinthepowerbudgetallocationsinpowerformationandcreatinganeventhermalprofileoftheresource
5、s.constrainedembeddedsystemdesigns.Ourintegratedthermalmanagementtechniqueonaveragereducesthepeaktemperatureoftheresourcesby7.34CwhencomparedVariouschippackagingandcoolingtechniquessuchasheattoathermalunawareflowwithoutincreasingthenumberofre-sink,fan,etc.havebeendeveloped.Guntheretal.[2]have
6、sourcesacrossoursetofbenchmarks.shownanonlinearrelationshipbetweenthecoolingcapabilitiesandthecostofthesolutionaspowerdissipationincreases.ThisIndexTerms—Architecturalsynthesis,resourceallocation,re-sourceassignment,scheduling,temperature.showstheimportanceoflimitingthemaximumtemperaturefore
7、fficientcontrolofheating.Asidefromthermalpackaging,therearetwoapproachestothermalmanagement:1)runtimethermalI.INTRODUCTIONmanagementand2)designplanningandoptimizationduringsynthesis.Inthispaper,wehavefocusedonintegratingthermalmanage-ONTINUOUStechno
