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1、SPECIALSECTIONONADVANCESINELECTRONICSSYSTEMSSIMULATIONModellingandsimulationtechniquesforhighlyintegrated,low-powerwirelesssensornetworksB.Otis,S.Gambini,R.Shah,D.Steingart,E.Que´vy,J.Rabaey,A.Sangiovanni-VincentelliandP.WrightAbstract:Thedesignofstate-of-t
2、he-artlow-powerwirelesssensornodesinvolvestheconvergenceofmanytechnologiesanddisciplines.Submicroncomplementarymetaloxidesemiconductor(CMOS)devices,micro-electro-mechanicalsystemfilters,on-andoff-chipelectromagneticelements,sensorsandthin-filmbatteriesaresome
3、ofthetechnologiesthatwillenablepervasivesystemssuchaswirelesssensornetworks.Highsystemcomplexityrequirestheuseofmanysimu-lationenvironmentduringdesign:algorithmsimulators,mechanicalfiniteelementanalysis,beha-viouralandtransistor-levelcircuitsimulators,electr
4、omagnetic(EM)simulators,thin-filmbatterysimulatorsandnetworksimulators.Itisshownthathighlyintegrated,self-containedsystemsrequiremultiple-domainsimulationstouncovercomplexinteractionsbetweendomains.Specificexamplesofblock-andsystem-leveldesignmethodologiesuse
5、dinlow-powerwirelesssystemsarepresentedhere.Bottlenecksinthecurrentmethodologywillbeidentifiedwithaneyetowardsimprovingthescopeandresolutionofsystem-levelsimulations.1IntroductionToallowdiverseconfigurationsinthesensorsandpowersourcesofthenodes,amodularapproa
6、chisdesirable.ThisRecently,theemergingconceptofAmbientIntelligencehaswouldallow,forexample,asolarenergyscavengerforpromisedtochangethewayhumaninteractwithtechnologyoutdoorapplicationsandavibrationalenergyscavengerfor[1].Thistechnologywillbereactiveanddistri
7、buted,afford-darkbutnoisyindustrialenvironment.Thisisasubstantialinghighlevelsofredundancyandfinespatialgranularity.departurefromtraditionalchip-on-PCBpackaging.InTheheartofthismovementisrootedinextremelysmall,addition,eachofthetechnologiesthatareintegratedo
8、nthisinexpensiveandubiquitouswirelesssensors.Thelevelofplatformisexperimentalandunproveninisolation.Thisdifficultyofimplementingasuitablehardwareplatformisincreasesthelevelofuncertaintyandtheneedforcomp
