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1、ASMSemiconductorEquipmentProductsIndexMaterialsMaterialsModelProcessModelProcessHandlingHandlingAD900A/8"WaferWaferLevelScanningandSortingWP808AD9012AHandlingPackagesSortingAD900TS/Equipment4"WaferWS896WaferScanningAD9012TSHandlingAD9012-BOCMS899SeriesMapSortingFlipChipAD92126"WaferMapSort
2、ingwithMS899ISeriesHandlingAOIAD9012TC12"WaferAS899DieSortingHandlingIS9012LARFIDSolutionMaterialsModelProcessAD8912HandlingAD8912SD-ATwinEagleXtremeEpoxyDAWireBondingEquipmentAD8912RLHarrierXtremeIS8912DAEagleXtremeAD898GoldBalliHawkXtremeThermosonicGoldWBBallWireBondAD838EagleXtremeX2LAD
3、838RiHawk-VEpoxyDAAD838LiHawk-02AD830Eagle60AP-LD8"WaferBumpingDieAttachEquipmentHandlingAD908Stud12"WaferGold/CopperHummingbird/-STEpoxy/EutecticHandlingStudBumpingAD830R/URDAWireBondingAD830UEutecticDAEquipmentHeavyHAWBAluminumWBSD890ASoftSolderUltrasonicWedgeAB559ASeriesWireBondFineSD83
4、2DSoftSolderAluminumWBAB530Epoxy/EutecticAD8930V/UVDAAD8930-02AD880MaterialsModelProcessEpoxyDAHandlingAD896series6"WaferHandlingSR902AD819-PDStripFormReflowOvenSubstrateAD819-LDSR902LAEutecticDACuringAD819-11BOvenCOE139/Strip/ReelCOE139RFormSnapCuringOvenAD819-11A/FlipChipSubstrate-11TSPC
5、139/PC139RMCM12Multi-purposeDATapingReelFormCPS12TapeAttachEquipTapeCOG900ACFD/APressingStripFormFOG900APS70ColumnPressingEquipSubstrateIS898GAMisc.GlassAttachLFReelFormLeadframeIRGA868CuttingLFC130LeadframeCuttingSystemLensHolderIS868LA2AttachLoadingOn/OffLoadingUnitsBOL139/SOL139EquipLoa
6、dingfrom/toCarrierSolderPasteDA/eClipClipAttachASMSemiconductorEquipmentProductsIndexMaterialsMaterialsModelProcessModelProcessHandlingHandlingIDEALcompress™SOT,SOD,MoldingEquipmentSOIC,TSSOP,TurretBasedStripFormOSPREYMSOP,FT2030STest&SubstrateQFN/MLP,FinishingIDEALmold™DPAK,TO,etc.80/120/
7、170tMoldingSystemReelFormIDEALmold™TestandFinishHandlingEquipmentSOT,SOD,SubstrateR2RSOIC,TSSOP,TurretBasedMSOP,FV2030Vision12"WaferWLP300QFN/MLP,InspectionDispensingDPAK,TO,etc./JettingStrip/ReelFormGlob-top,Dam&DS500SeriesSubstrateFillSawnDFN,StripFormQFNCSB
