Spirent Communications思博伦通信

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1、SpirentCommunicationsPerformanceAnalysisBroadbandDivision-HonoluluDevelopmentCenterPCBCADDesignGuidelinesDocument001-7001-001Rev.A18-Oct-02RevisionHistoryRevisionDescriptionofChangeECOAInitialReleaseE03640-12iMiscellaneousNotes1)Companiesusedtocreatetheseguidelines:TTMTechnologiesCon

2、tact:KipAnderson-(714)327-3034;kanderson@ttmtech.com2630S.HarborBlvd.SantaAna,California92704VelieCircuitsContact:StuartFroman-(714)751-4994;sfroman@velie.com1267LoganAvenueCostaMesa,California92626MultekContact:TonyDeSmet-(949)609-7288;tony.desmet@multek.com40ParkerIrvine,California

3、92618DynamicDetails,Inc.Contact:TerryTalley-(714)390-1700;ttalley@ah.ddiglobal.comorterrytal@pacbell.net1220SimonCircleAnaheim,California92806VIASYSTEMSPortland,Inc.Contact:ReySosa-(503)672-4324;rey.sosa@viasystems.com9825SWSunshineCourtBeaverton,Oregon97005FinePitchContact:LawrenceL

4、u-(408)894-83932265JunctionAvenueSanJose,California951312)Alldimensionsgiveninthisdocumentareininchesunlessotherwisespecified.3)"Standard"indicatesthedesignguidelinesinwhichallthecurrentPCBmanufacturerscanbuildto;noadditionalcostsshouldbeencountered.4)"Advanced"indicatesthedesignguid

5、elinesinwhichonlyoneormorePCBmanufacturershaveindicatedtheabilitytomeet.Additionalcost,risk,andyieldissuesareassociatedwiththesefigures.Thetrade-offsshouldbecarefullyweighedbeforepursuingthisoption.5)ThisdocumentisasnapshotofourcurrentPCBmanufacturer'sandassemblyhouses'capabilities.I

6、tisgenerallyagreeduponthattechnologymovestooquicklytoguaranteethatalltherecommendationsgivenherearecurrent.Ifthereareanydoubts,pleasefeelfreetocontacttheCADdepartment,PCBmanufacturer,orassemblyhousetomakesurebeforeproceeding.Theremaynothavebeenenoughtimetoupdatethisdocumentwiththenew

7、figures.iiTableofContentsNon-PlatedHoles...................................................................................................................................................1Silkscreen/Legend...............................................................................

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