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1、2011IEEEInternationalSymposiumonDefectandFaultToleranceinVLSIandNanotechnologySystemsAUnifiedErrorControlCodingSchemetoEnhancetheReliabilityofaHybridWirelessNetwork-on-ChipAmlanGangulyDepartmentofComputerEngineeringRochesterInstituteofTechnologye-mail:amlan.ganguly@rit.eduParth

2、aPande,BenjaminBelzerSchoolOfElectricalEngineeringandComputerScienceWashingtonStateUniversitye-mail:{pande,belzer}@eecs.wsu.eduAlirezaNojehDepartmentofElectricalandComputerEngineeringUniversityofBritishColumbiae-mail:anojeh@ece.ubc.caAbstract—HybridwirelessNetwork-on-Chip(NoC)h

3、asemergedasanalternativetothetraditionalmulti-hopwirelineNoCtoachievehigherperformanceandlowenergydissipationinon-chipdatatransfer.However,introductionofon-chipwirelesslinkslowerstheoverallreliabilityofthedatacommunicationfabric.InthispaperweproposeaunifiedErrorControlCoding(EC

4、C)mechanismwhichcanbeeffectivelyusedtorestorethereliabilityofaWirelessNoC(WiNoC).WedemonstratethatwithcarefullydesignedECCschemesintheWiNoCitispossibletoachievehighgainsinperformanceduetothewirelesslinkswhilemaintainingcomparablereliabilityasthatofatraditionalwirelineNoC.Keywor

5、ds-Network-on-Chip,ErrorControlCoding,WirelessInterconnectsI.INTRODUCTIONDesignofmulti-coreintegratedsystemsbeyondthecurrentCMOSerawillpresentunprecedentedadvantagesandchallenges,theformerbeingrelatedtoveryhighdevicedensitiesandthelattertosoaringpowerdissipationissues.According

6、totheInternationalTechnologyRoadmapforSemiconductors(ITRS)in2007,thecontributionofinterconnectstochippowerdissipationisexpectedtoincreasefrom51%inthe0.13!mtechnologygenerationtoupto80%inthenextfiveyearperiod.Thisclearlyindicatesthefuturedesignchallengesassociatedwithtraditional

7、scalingofconventionalmetalinterconnectsandmaterialinnovation.Toenhancetheperformanceofconventionalmetalinterconnect-basedmulti-corechips,afewradicallydifferentinterconnecttechnologiesarebeingcurrentlyexploredsuchas3Dintegration[1],photonicinterconnects[2]andmulti-bandRF[3]orwir

8、elessinterconnects[4].Allthesenewtechnologieshavebeenp