LED中英文常用辞汇对照表之PCB相关术语

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1、sales@fidelio-hk.com[/email] LED中英文常用辞汇对照表之PCB相关术语板board母板motherboard子板daughterboard背板backplane裸板bareboard印制电路printedcircuit印制线路printedwiring印制板printedboard印制板电路printedcircuitboard印制线路板printedwiringboard印制元件printedcomponent印制接点printedcontact印制板装配printedboardassembly刚性印制板rigidprinte

2、dboard挠性印制电路flexibleprintedcircuit挠性印制线路flexibleprintedwiring齐平印制板flushprintedboard金属芯印制板metalcoreprintedboard金属基印制板metalbaseprintedboard多重佈线印制板mulit-wiringprintedboard模塑电路板moldedcircuitboard散线印制板discretewiringboard微线印制板microwireboard积层印制板buile-upprintedboard表面层合电路板surfacelaminarci

3、rcuit埋入凸块连印制板B2itprintedboard载芯片板chiponboard埋电阻板buriedresistanceboard键盘板夹心板copper-invar-copperboard动态挠性板dynamicflexboard静态挠性板staticflexboard可断拼板break-awayplanel电缆cable挠性扁平电缆flexibleflatcable(FFC)薄膜开关membraneswitch混合电路hybridcircuit厚膜thickfilm厚膜电路thickfilmcircuit薄膜thinfilm薄膜混合电路thinf

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5、laminate(CCL)复合层压板compositelaminate薄层压板thinlaminate基体材料basismaterial预浸材料prepreg粘结片bondingsheet预浸粘结片preimpregnatedbondingsheer环氧玻璃基板epoxyglasssubstrate预制内层覆箔板masslaminationpanel基底substrate基板面realestate导线面conductorside元件面componentside焊接面solderside印制printing网格grid图形pattern内层芯板coremate

6、rial粘结层bondinglayer粘结膜filmadhesive无支撑胶粘剂膜unsupportedadhesivefilm覆盖层coverlayer(coverlay)增强板材stiffenermaterial铜箔面copper-cladsurface去铜箔面foilremovalsurface层压板面uncladlaminatesurface基膜面basefilmsurface胶粘剂面adhesivefaec超薄型层压板ultrathinlaminate结晶现象crystallinepolamer双晶现象dimorphism共聚物copolymer环

7、氧值epoxyvaluesales@fidelio-hk.com[/email] 双氰胺dicyandiamide粘结剂binder胶粘剂adesive固化剂curingagent阻燃剂flameretardant遮光剂opaquer增塑剂plasticizers氟树脂fluroresin硅树脂siliconeresin阶树脂A-stageresinA阶树脂B-stageresinB阶树脂C-stageresinC环氧树脂epoxyresin酚醛树脂phenolicresin聚酯树脂polyesterresin聚醯亚胺树脂polyimideresin合成树脂

8、synthetic热固性树脂thermosettin