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1、MaterialsandDesign84(2015)331–339ContentslistsavailableatScienceDirectMaterialsandDesignjournalhomepage:www.elsevier.com/locate/jmadThermalproperty,wettabilityandinterfacialcharacterizationofnovelSn–Zn–Bi–Inalloysaslow-temperaturelead-freesoldersaa,⁎,Zheng-HongWangaabJian-ChunLi
2、u,GongZhang,Ju-ShengMa,KatsuakiSuganumaaDepartmentofMechanicalEngineering,TsinghuaUniversity,Beijing100084,ChinabInstituteofScientificandIndustrialResearch,OsakaUniversity,Mihogaoka8–1,Ibaraki,Osaka567–0047,JapanarticleinfoabstractArticlehistory:Theeffectofindium(In)additiononthe
3、rmalproperty,microstructure,wettabilityandinterfacialreactionsofReceived4February2015Sn–8Zn–3Bilead-freesolderalloyshasbeeninvestigated.ResultsshowedthatadditionofIncouldlowerbothReceivedinrevisedform24June2015solidusandliquidustemperaturesofthesolderalloyswithwettabiltysignifica
4、ntlyimproved.ThespreadingAccepted26June2015areaofSn–8Zn–3Bi–1.0Inwasincreasedby34%comparedtothatofSn–8Zn–3Bi.WiththeincreaseofIncontent,Availableonline02July2015Zn-richprecipitatesweresmallerinsizeanddistributedmoreuniformly,whichmightbebeneficialformechan-icalpropertiesandcorros
5、ionresistanceofthesolders.Theintermetalliccompounds(IMCs)formedbetweenSn–Keywords:Lead-freesolder8Zn–3Bi–xInsolder/CusubstratewasidentifiedasCu–ZnwithascalloplayeradjacenttothesolderandaflatIndiumlayertothesubstrate.TheadditionofInslightlyinfluencedthethicknessoftheIMCs.Thenewlydev
6、elopedThermalpropertySn–Zn–Bi–InsoldersystemhasgreatpotentialtoreplacetheSn–Pbsoldersaslow-temperaturelead-freesolders.Wettability©2015ElsevierLtd.Allrightsreserved.IMCs1.Introductionelements,canbeaneffectiveapproachtoimprovethepropertiesofSn–Znsolders[6–10].Heretofore,avarietyo
7、flead-freesolderalloys,includingSn–Zn,Sn–AdditionofBicouldobviouslyimprovethewettabilityofSn–Znsol-Ag,Sn–CuandSn–Bibinaryalloysaswellascertainternaryandquater-dersandlowerthemeltingpoint[11–13].Thus,theSn–Zn–Bialloysarenaryalloys,havebeenproposedasalternativesoftheconventionalPb
8、-regardedaspromisinglead-freesoldercandidates.H
