Genesis操作指引

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1、Genesis操作指引序号流程菜单或命令注意事项1Input原稿文件含Wheel文件,并创建job及editstepIdentifyTranslate注意不规则光圈表和钻孔前后省零读入的正确性2层命名层排序定义层属性Jobmatrixpopup按板由上到下排序3对齐所有层editmove或register4增加rout层和Copy定义Profile外围线生成rout层并建立profilerout层要定义属性5定义Origin和datumSnappopuporigStepdatumpointOrigindatum

2、全部定于profile的左下角6原稿层复制做备份Jobmatrixpopup中copy属性为misc7a文字层成型线外文字移入/或删除7b删除profile以外的东西以及成型线Editcliparea外层防焊文字正性内层删除成型线,其余保留8a删除多余的线Dfmredundancycleanupredundancylineremoval8b自动转padDfmcleanupconstructpads先转防焊后参照防焊转线路,转pad后检查正确是否9Compare转pad后的线路,防焊选Layermenu下gr

3、aphiccompare或目视比较，尤其注意BGA位10a定义孔的属性Drilltoolsmanager10b产生referencenetlistActionsetlistanalyzer11a加大钻嘴Drilltoolsmanager正确定义孔属性(viapthnpth)客户未提供钻孔时分孔图转钻孔11b有slot时padtoslots或addslot.12钻孔与焊盘对齐Dfmrepairpadsnapping注意所有层向L1层对齐13Openchecklistorig分析客户资料AnalysisDril

4、lcheckspowergroundcheck内层正性signallayercheckssignallayercheckssoldermaskcheckssilkscreenchecks14a修改内层菲林(负性)优化隔离pad,功能pad内削铜箔Dfmoptimizationpowergroundopt加宽边框线14b修改内层菲林(正性)删除独立pad和npthpad补偿线宽优化线路加泪滴(指内层条)填小间隙内削铜箔dfmredundancyclenauyfpremovalisolatedpad

5、sdfmyieldimprovementetch  compensate或手动补偿dfmoptimizationsignallayeropt或dfmoptimizationpositiveplaneoptdfmyieldimprovementadvancedteardropscreationdfmsliversliver´加大rout层反掏15Openchecklistinn分析内层资料Analysispowergroundcheck内层正性signallayerchecks16比较

6、原稿Compare或手动对比17netlist比较Actionsetlistanalyzer18Pnl1排板与编辑(单pcs排板跳过此步骤)SteppanelizationpanelsizeSteppanelizationstep&repeattableSteppanelizationS&Redit19Pnl1自动加板边(script)快捷键F8/是否单pnl1加logo等20Panel排板与编辑SteppanelizationpanelsizeSteppanelizationstep&re

7、peattableSteppanelizationS&Redit21Panel自动加板边(script)快捷键F822加内层平行曝光机,PE机和外层曝光机定位孔23自动加尾孔,切片孔和输出钻孔程序快捷键F924输出内层光绘资料与map图及TGZ文件压缩为*.RAR放入服务器25定义SMD属性Dfmcleanupsetsmdattribute26修改外层菲林删除npthpad补偿线宽补偿SMD外层优化加泪滴(指内层条)        填小间隙npth挖铜内削铜箔填针孔dfmredundancyclenauy

8、fpremovalpthpads手动补偿线dfmyieldimprovementetchcompensate补偿SMDdfmoptimizationsignallayeroptdfmyieldimprovementadvancedteardropscreationdfmsliversliver´加大npth孔反