MEMS packaging and reliability

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1、ESS480000微系統工程原理Lecture10:Lecture10:Lecture10:微系統封裝及可靠度微系統封裝及可靠度微系統封裝及可靠度(MEMSPackagingandReliability)(MEMSPackagingandReliability)(MEMSPackagingandReliability)饒達仁助理教授饒達仁助理教授(Da(Da--JengJeffreyYao)JengJeffreyYao)國立清華大學微機電系統工程研究所國立清華大學微機電系統工程研究所1WhyWorryAboutPackaging?•Thepackageisi

2、ntegraltothefinalproduct•Youdon’thaveaproductuntilitsinapackage•Packageis40-80%ofproductcost•Costumedpackagingsolutionshavelongleadtime•Packagingdesignmustbeapartofproductdesign,notanafterthough•Designformanufacture&concurrentengineering•Considerproducttrade-offsupfront2ICPackageRe

3、liability•Problemsinpackagingaffectyourbottomline!•ICworldhas40yearsonthelearningcurve•MEMShasessentiallynone!•So,wemustlearnwhatwecanfromICworld3Microelectronic(IC)Packaging•Mechanicalsupportbysiliconsubstrate•Electricconnection–Withoutwiring,ICisuseless–Powerdistribution(layout)•

4、Thermalmanagement–Heatdissipationproblem•Protectionfromenvironment–Lifetimeandreliability•Variabilityofpackagingstyles–DIP,TAB,BGA,flip-chip,etc…–Cost,performance,andsizetrade-offs4MoreComplicatedMEMSPackaging•Bothelectricalandmechanicalparts•Lessthermalissueproblem,ingeneral•SomeM

5、EMSmaybeisolatedfromenvironment,somemightneedtointeractwithsurroundings•Someoftheissues–Gasorfluidicinterconnects–Fiber/opticsinterconnectsorintegration–Vacuumpackaging–Precisionalignment(accelerometer,opticalswitches)•Takewhatwecan,figurehowtodotherest!•Bigquestioniswhentodotherel

6、easeetching?5AnOverviewofPackagingProcess•Waferlevelfunctionaltest•Separateintoindividualdie(chip)•Mechanicallyattachtopackageorchipcarrier(diebonding)–Singlechipmoduleormultichipmodule–Electricallyattachtopackage(wirebonding)•Enclose,encapsulate,sealpackage•Functionaltestatpackage

7、level•Sell6WaferLevelICTest•AutomatedtestersdeterminewhichICsaregood–Don’twanttopackagebadchips($$$)–Labelpackageproperly(chipspeed=$$$)•TestingMEMSfunctionalityrequiresreleasedMEMSstructure–CurrenttestersnotcompatiblewithMEMS•WhatcouldreplacewafertestforMEMS?–Electricalteststructu

8、resprobedbeforerelease?–Te