2、1,晶圆处理工序(Wafer Fabrication)2,晶圆针测工序(Wafer Probe)3,构装工序(Packaging)4,测试工序(Initial Test and Final Test)等其中晶圆处理工序和晶圆针测工序为前段(Front End)工序,而构装工序、测试工序为后段(Back End)工序。IC制造过程图图如下Front-endBack-endDiebankBinsFinalGoodsInventoryWaferFabProbeAssemblyRawTestFinalTestIC的制造过程1,晶圆处理制程: