1、集成电路封装工艺 摘 要 集成电路封装的目的,在于保护芯片不受或少受外界环境的影响,并为之提供一个发挥集成电路芯片功能的良好环境,以使之稳定,可靠,正常的完成电路功能.但是集成电路芯片封装只能限制而不能提高芯片的功能. 关键词: 电子封装 封装类型封装技术器件失效IntegratedCircuitPackagingProcessAbstract The purpose of IC package, is to protect the chip from the outside or less environmental im
2、pact, and provide a functional integrated circuit chip to play a good environment to make it stable and reliable, the completion of the normal circuit functions. However, IC chip package and not only restricted to enhance the function of the chip. 引言电子封装是一个富于挑战、引