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1、MarkII+IonSourceExclusivedistributor:SunnetSystemsInc.Cell:+8618665816782Contact:CarlJinMarkII+IonSource-Overview°IonSourceImprovements°FasterMaintenance°GreaterPerformance°SmallerFormFactor°Configurations°Radiationcooled(<900W),FilamentCathode°Watercoole
2、d(<1500W),FilamentCathode°Watercooled(<3000W),HollowCathode°AnodeAssemblySoldSeparately(foreach)°NewFeedthrough,VacuumLeads&PowerCable°ImprovedDesignforgreaterreliability©2006VeecoInstrumentsInc.MarkII+-ImprovedEnd-HallSourceFeaturesoftheMarkII+•Removable
3、,indirectly-cooledanodeAnodesub-assemblywiththermaltransfertoAssembly(allconsumables)water-cooledpartitionplate[2]•Commoncomponentsforradiation-andwater-cooledoptions•Serviceableanodeandfrontplatecomponentsareeasilyremovedandquicklyreplacedwithoutdisrupti
4、ngwater,gasorelectricalservicesElectricWater•LowertemperatureandwearratesGasofconsumablegasdistributionplate[2]PatentPending:D.Burtner,et.al.,“FluidCooledIonSource”,USPatentApplicationNo.20050248284,Nov.11,2005.MarkII+:FilamentCathode,Water-Cooled©2006Vee
5、coInstrumentsInc.MarkII+MaintenanceImprovementsDoubleclickimagetostartvideo©2006VeecoInstrumentsInc.MarkII+-IonBeamCurrentDensityProfilesArgonbeamcurrentdensitiesoftheMarkII+arerelativelyhigherandaremorebroadlydistributedwhencomparedtotheearlierMarkII.Bea
6、mCurrentmeasuredinoxygen(notshown)showsimilarresults.MII100V)0.82MII200V0.7MII300VMII+100VmA/cm0.6MII+200VMII+300V0.50.40.30.20.1BeamCurrentDensity(0-90-75-60-45-30-150153045607590Angleθ(degrees)Ji(θ)forMarkIIandMarkII+sources(Water-cooledw/Hot-filament)a
7、tR=30cm,inargonatIA=5Aandatvariousanodepotentials.©2006VeecoInstrumentsInc.MarkII+PerformanceImprovementsIncreasedTotalBeamCurrent(atcomparabledischargeconditions)16001400MarkII+•Argon1200•Filament1000MarkIINeutralizer800•5AmpDischarge600400200Ionbeamcurr
8、ent,Ib,mA0050100150200250300350Dischargevoltage,Vd,V©2006VeecoInstrumentsInc.MarkII+PerformanceImprovementsIncreasedTotalBeamCurrent(atcomparabledischargeconditions)3500•Oxygen3000MarkII+•Hollow2500Cathode2000Neutra
