sample requirement

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1、ATTACHMENT附件APPLICABLESTANDARD:适用的标准：•TheStandardforPrinted-WiringBoards,UL796,NinthEdition,Reviseddate2009-04-23.(CCN:ZPMV2)印刷线路板标准，UL796，第九版。发行于2006-04-17,最后修订于2009-04-23.（产品类别：ZPMV2）ASSUMPTION:•Basedonyourcorrespondenceforthisprospect,wehavedeterminedthat,pendingcomplianttesting,youw

2、ishforfollowingTypestobeRecognizedasshowninthetablebelow.Pleaselookoverthefollowingtableandadviseusifthereareanyerrorsorchangestobemade.PatternLimitsSolderLimitsMeetsCopperMax.SS/DirectMin.Weight*Max.Min.UL94ANSIMfg.Min.Max.Max.OperatingTypeDsgn.DS/SupportThk.$AreaEdgeFlameGradeProc.Wid

3、thTemp.TimeTemp.MLRequire-(mm)Diam.WidthoClassMin.Max.(mm)(°C)(sec.)(C)ment?(mm)(mm)(mic)(mic)RZ-010.60E:17265DSALLFR-4AE:1020.1325.40.1510130V-0(V1S1)0.38E:12288RZ-020.46I:68265MLALLFR-4BE:120.1325.40.1510130V-0(V1S2)0.38I:102288$-RecognizedMinimumBoardThicknessforPrintedWiringBoard.*-

4、RecognizedMinimumExternalCopperWeight(E)andMaximumInternalCopperWeight(I)forPrintedWiringBoard.V=Volume,S=SectionTheconstructionofRZ-02:C:DocumentsandSettings17990FavoritesDesktophuaxiangPWB06--ProspectSheet-new&common(UL796,9th)RevisedDate:5/8/09,Page1(lean).docSAMPLESREQUIRED:•T

5、est測試項目:BD-10-and56-DayBondStrengthandDelaminationTest(seeattachmentT2,見附件T2)94V-UL94VerticalFlammabilityTest(seeattachmentT5,見附件T5)SampleDesiredbaseDesiredBaseCopperWt.(mic)DesiredMinimumMin.Min.material銅箔厚度MinimumDesiredMax.EdgeSetLam.PrepregThk.Mfg.ConductorUnpiercedConductor#TypeBas

6、ematerial-(mm)(mm)(mm)No.ofPro－WidthAreaDiameterWidth樣品Dsgn.Laminate/Prepreg基板料半固化片樣品基材Plating/CoatingTestSamplescessE*I*最小線寬度銅面最大直徑最小邊緣線編號型號基板/半固化片最薄厚度最薄厚度厚度^表面處理測試專案樣品數量工藝外層內層(mm)(mm)寬度(mm)SolderwithNi/Aucontact1.RZ-01InternationalILM-R1##--0.38-0.43BD10A12$-0.1325.40.15fingersand4orm

7、orePTHsSolderwithZhejiangHuazhengNi/Aucontact2.RZ-01--0.38-0.43BD10A12$-0.1325.40.15FR4-74fingersand4ormorePTHsSolderwithZhejiangHuazhengNi/Aucontact3.RZ-01--0.38-0.43BD10A12$-0.1325.40.15H140-1fingersand4ormorePTHsSolderwithInternationalILM-Ni/Aucontact4.#RZ-02U1##/Goworld0.15