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1、ProductInformationGuidelinesforDesigningSubassembliesUsingHall-EffectDevicesByJohnSauberandBradleySmithAllegroMicroSystems,Inc.IntroductionStress-SensitiveLocationsTheHalleffect,discoveredbyE.H.Hallin1879,istheThereareseverallocationsonapackagewhicharevulnera-basisforallHall-effectd
2、evices.Whenthisphysicaleffectbletostress,asshowninfigure1.Regardlessofthemethodiscombinedwithmodernintegratedcircuit(IC)technol-usedforbuildingasubassembly,itisimportanttominimizeogy,manyusefulmagneticsensingproductsarepossible.thestressintheseareas.TheHallelement,whenproperlybiased
3、,producesanoutputvoltagethatisproportionaltoamagneticfield.ThissmallFailureModesvoltageisprocessedthroughahigh-qualityamplifier,whichproducesananalogsignalthatisproportionaltotheappliedThelocationsshowninfigure1areassociatedwiththefol-fluxdensity.InAllegro®Hall-effectdevices,thesign
4、alislowingfailuremodes:conditionedandoptimizedforvarioustypesofmagnetic(A)Forcesoverthediefacecancausecrackingofthedie.inputstoproduceasuitableelectricaloutput.Thediemayfailimmediately,oritmayhaveacrackwhichHall-effectelementsrespondtostressbymodifyingtheisalatentdefect.SeetheDesign
5、ValidationTestingsectionoutputvoltageversusthemagneticflux-densitycurve.Forforinformationonfindinglatentdefects.Forcesoverthediethisreason,itisimportantthatdesigners,fromchiptofinalcanalsocauseelectricalparametershift.Ifforcemustbecustomer,understandthatenvironmentalstressfromtherma
6、lappliedtothedieface,itshouldbedistributedevenlyoverormechanicalsourcescanaffecttheoutputofaHall-effecttheentiretopsurface.element.Thechipdesigneranticipatestheenduse,buildscompensationcircuits,andconnectsmultipleHallelementsinsuchamannerastominimizetheeffectsoftheantici-DieFacepate
7、denvironment.WhentheproperICdesignismatchedwiththeproperpackagedesign,environmentaleffectsareminimized.WiresLeadsAlthoughrobustdesigntechniquesgreatlyreducetheeffectsAthatpackagestressesmayplaceontheoperationoftheHall-effectIC,itisimportantthatassemblymanufacturerstakeprecautionstoa
8、voidunnecessaryexte
