集成电路封装发展

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1、集成电路封装发展摘要：集成电路封装是指利用膜技术及细微加工技术，将芯片及其他要素在框架或基板上布局、粘贴固定及连接，引出接线端子并通过可塑性绝缘介质灌注固定构成整体立体结构的工艺。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接，从而实现内部芯片与外部电路的连接。集成电路封装是伴随集成电路的发展而前进的。随着集成电路及封装技术的不断发展，整机也向着多功能、小型化方向发展。这样，就要求集成电路的集成度越来越高，功能越来越复杂。相应地要求

2、集成电路封装密度越来越大，引线数越来越多，而体积越来越小，重量越来越轻，更新换代越来越快，封装结构的合理性和科学性将直接影响集成电路的质量。因此，对于集成电路的制造者和使用者，系统的认识和了解当下主流的集成电路封装技术，就显得非常的必要。关键词：IC封装；集成电路；封装技术IntegratedcircuitpackagingdevelopmentAbstract:Integratedcircuitpackagingisaprocesswhichusemembranetechnologyandfineprocessingtechnologytolay

3、out,pasteandfixed,andconnectstheICandothercomponentsontheleadframeorPCBboardtodrawforthterminalandformwholesolidconstructionusinginfusionfixedmethodwithplasticityinsulatingmedium.Itisnotonlyveryimportanttosetupandfixingandsealingandprotectingchipandtoenhancetheperformanceofele

4、ctricheatingproperty,butalsoimportanttoachieveconnectingbetweeninnerchipandexternalcircuitwhichusingconductortodrawforthterminalfromtheoutputpointoftheinnerchiptoformtheterminalofpackageshell.ThenusethoseterminalsandthecircuitonPCBboardtoconnectothercomponents.Integratedcircui

5、tpackagingwasgonealongwiththedevelopmentofintegratedcircuit.Duringthecontinuousdevelopmentofintegratedcircuitandpackagetechnology,thewholesetalsobecomesmallerandsmaller,andthesametimethefunctionbecomemoreandmorepowerful.Sorequireintegratedcircuittobecomemoreandmoreintensiveand

6、complextocatchit.Correspondinglyrequireintegratedcircuitpackagingtobecomemoreandmoreintensiveandthenumberofterminalbecomemoreandmore,thesizeandtheweightbecomesmallerandsmaller,theupdatingoftechnologybecomefasterandfaster.Thereasonabilityandscientificityofpackagestructurewillaf

7、fectdirectlythequalityofintegratedcircuit.Thereforeitisverynecessarytosystematicallystudyandlearncurrentpopularintegratedcircuitpackagingtechnologyforthemanufacturersandusers.Keywords:Integratedcircuitpackaging;Integratedcircuit;Packagingtechnology1引言随着电子产品在个人、医疗、家庭、汽车、环境和安防系统

8、等领域得到应用，同时在日常生活中更加普及，对新型封装技术和封装材料的需求变得愈加迫切。从80年代中后期开始电子产品正朝着便