基于循环应力增强氧化疲劳的硅微结构寿命建模研究

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1、分类号TB114.3学号14030039ＵＤＣ密级公开工学硕士学位论文基于循环应力增强氧化疲劳的硅微结构寿命建模研究硕士生姓名张曼学科专业机械工程研究方向可靠性试验与评估指导教师陶俊勇教授国防科学技术大学研究生院二〇一六年十一月StudyonLifetimeModelofSiliconMicrostructureBasedonCyclicStressEnhancedOxidationFatigueCandidate：ZhangManAdvisor：TaoJunyongAdissertationSubmittedinpartialfulfillmentoftherequirementsf

2、orthedegreeofMasterofEngineeringinMechanicalEngineeringGraduateSchoolofNationalUniversityofDefenseTechnologyChangsha，Hunan，P.R.China（November，2016）国防科学技术大学研究生院硕士学位论文目录摘要...............................................................................................................................

3、iABSTRACT.....................................................................................................................ii第一章绪论.....................................................................................................................11.1研究背景与意义...................................

4、.............................................................11.2硅微结构疲劳失效研究现状............................................................................21.2.1MEMS硅微结构......................................................................................21.2.2硅微结构疲劳失效的影响因素........................

5、......................................31.2.3硅微结构疲劳失效机理的研究现状......................................................41.2.4硅微结构疲劳寿命建模与预测的研究现状..........................................61.3研究思路与内容安排........................................................................................81.3.1研究思路......

6、............................................................................................81.3.2内容安排..................................................................................................8第二章循环应力增强氧化疲劳失效机理分析...........................................................102.1基于应力腐蚀开裂疲劳失效

7、机理的寿命建模分析......................................102.2循环应力增强氧化疲劳失效机理分析..........................................................142.3循环应力增强氧化原理分析..........................................................................182.3.1