选择性化学镀镍实验研究

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1、I胀：DC5：兰!兰冀ji垃东南大硕士掌位论文选择性化学镀镍实验研究研究生姓名：童丞照导师姓名：挞睦龌豇数撞堕重3熬援￡

2、【请学位级别—』型越匾±一学科专业名称—j删盘是盘珏理吐一f、论文提交日期29Q§生!且论文簪辩目期—垫堂皇望月r皇t且—～学位授予单位盔亩太掌学位擐予吲期二__垫鲤圭L童——且一答辩蚕员会主席—』龟鳖堡—一评阅^————垂超堕=．——。，二二二耋婆噩L一2006年3月AbstractExperimentalResearchonSelectiveElectrolessNickelPlatingB

3、yYuanCheng-chanSupervisedbyLinXiao-hniandChanYon-fciMechanicalEngineeringDepartment,SoutheastUnivzrsityEk℃trolessplatingplaysanimportantroteinmodernsarf∞eengineering．ElectrolessdepositiOllisa$t1．rfaceamocamly虹credoxprocess．Prctrcatmantofthesubstratesurfacehasa

4、decisiveinfluenceduringthewholeprocess．C㈣tly。electrolessdepositionofn把诅_lshasmanyapplicationsinmicro-andnano-technologies．n塘investigationsofnanosu-tlctLll'eSfabricatedonsiliconwaferforthedevelopmentofnano-deviceshavebeenreportedsuccessively．Inthiswork,锄experim

5、entofselectiveelectrolessnickeldeposifiononsiliconwaferinaqueoussolutionwascarriedouLSelectiveNidepositionwaSperformedbyusinglasefablatingprocess．Thismethodpresentsarelativelysimpleprocessforfabricationofnigh-aspect-ratiomcmUicstructures．E1cctrolessmethodsoffe

6、rnigh-quaJityultraihinfilmsthatarecompatiblewithhighresolutionpatternsinphotosensitivepolyimideprocess．Awiderangeofstudieshaveinvestigatedtheelectrolessnickel(EN)platingmechanism。Severalreactionpathshavebeenproposed,whichweredevelopedfromplatingrammeasurements

7、．Despitethelargenumberofinvestigations,thedepositionkineticsissofarnotwellestablished．AnempiricalrateequationbasedonnonsteadystatediffusionoftheelectrolessNi-playershasbe∞developed．Electrolessnickel(El∞depositionbathisknowntohaveamajorproblemofsuddenbathdecomp

8、osition,wnichresultsin锄increaseintheoperatingcostoftheprocessandthegenerationofenvironmentallyhazardouswaste．Bathstabilizersarenormallyaddedtoextenditslife．AproperstabilizationsTstemwillprohibittheself-decompositiontoenhancA}thesolutionstability．Itisindicatedt

9、lmtthesolutionstabilityinconstantplatingconditionschangesdramaticallywithtimeandplatingloading．KeyWords：eleclrolessnickelplating,seletive，deposition,thinfilm,stabilityⅡ东南大学学位论文独创性声