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ID:36353156
大小:15.89 MB
页数:300页
时间:2019-05-09
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1、AdvancedThermalModelingAdvancedThermalModelingIcepak高级建模Fluent.incCourseOutline1.Introduction简介2.PrintedCircuitBoards(PCB板)3.ICPackages(IC封装)4.HeatSinks散热器5.InterfaceResistance接触热阻6.Fans,ImpellersandBlowers风扇,叶轮,离心风机7.AltitudeEffects高度的影响8.FlowResistances气流阻尼9.Radiation幅射
2、10.HeatPipes热管11.JouleHeating电阻发热12.ThermoelectricCoolers热电冷却CourseOutline13.ColdPlates冷板14.Transformers变压器15.FlowBaffles气流挡板16.WallEffects壁的效果17.ExternalCoolers/Heaters外部冷却器/加热器Exercises:练习:1.PBGAModelPBGA模型2.SelectingaHeatSink选择散热器3.ModelingTEC热电冷却器模型4.SelectingaBaffle选
3、择挡板5.ModelingExternalCoolers外部冷却器建模IntroductionIntroduction简介TheCaseforThermalManagementTheheatgeneratedinanelectroniccircuitisinverselyproportionaltotheefficiencyofthecircuit电子线路板产生的热与它的效率成反比Thepowerthatisnotconvertedtoperformusefulelectromagneticworkislostintheformofhea
4、ttothesurroundings没有转换成电磁功率的热耗散到了周围的环境Thepowerwastedasheatincludes:热耗包括Jouleheating(I2R)loss电阻损失Powersupply电能提供Thereliabilityofasemiconductordeviceisdirectlyaffectedbyitsoperatingtemperature工作环境的温度直接影响到半导体设备的可靠性TheCaseforThermalManagementVirtuallyallelectronicfailuremecha
5、nismsareenhancedbytheincreaseinpackagetemperature:实际上,所有电子失效的机理都是由于封装温度升高引起的StressesduetoTCE(=TotalCompositeError总综合误差)mismatch不匹配Corrosion腐蚀Electro-migration电子移动Oxidebreakdown氧化物崩溃Currentleakage(whichdoubleswithevery10cinactivedevices)电流泄漏Degradationinelectricalperforman
6、ce(duetochangeindeviceparameters)电性能下降TheCaseforThermalManagementTherateoffailureofelectronicpackagesisdirectlyproportionaltoheatandincreasesexponentiallywiththemaximumtemperatureofthepackage电子封装失效的比例直接与热成正比,而且与封装的最高温度成指数增长Therateoffailurecanbeexpressedas:失效的比例可描述为:F=Ae-E
7、/KTwhere,F=failurerate,失效率A=constant常数E=activationenergyinelectronvolts(eV)激活的电能K=Boltzmann’sconstant(8.63e-5eV/K),andT=junctiontemperatureinKTheCaseforThermalManagementTheCaseforThermalManagementTheEffectofPackageTemperatureonFailure(Numberoffailuresafter1000hrofoperatio
8、npermillionunits)每百万个元件工作1000hr失效的数目TheCaseforThermalManagementMajorCausesofElectronicFailure电子失
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