array工程简介

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1、ARRAY工程简介NPI段晓海目录ARRAY制造流程图PVD简介CVD工程WET工程DRY工程PHOTO工程TSET简介2ARRAY制造流程图3TFTArray组成材料4TFT–GATE电极形成5TFT–Active(岛状半导体形成)6TFT–S/D源漏电极形成7TFT–钝化层及接触孔形成8TFT–ITO像素电极形成9PVD简介物理气相沉积PVD(PhysicalVaporDeposition)阴极靶材阳极腔体泵基板10PECVD简介电浆辅助化学气相沉积PlasmaEnhancedChemicalVaporDepositio

2、n11WET简介--湿刻设备构成INCVEUVNCVETCHZONEDIRINSEUNITA/Kdry2dry1液刀风帘干燥风刀置换液刀OutCV12WET简介—各工艺单元功能设备主要工艺单元：EUVunit:祛除玻璃表面有机残留物。Etchzone:刻蚀区域Rinseunit:水洗单元Dryunit：干燥单元液刀：主要起预湿（置换），冲刷的效果。风帘：主要是吹掉玻璃上残余的药液风刀：干燥的玻璃的效果。13WET简介—工程概念图14DRY简介光阻剥膜15DRY简介16PHOTO-曝光显影蚀刻基本概念17PHOTO-显影18P

3、HOTO-显影19TEST–AOI–Autoopticalinspectionconfiguration20TEST–AOI–Autoopticalinspectionconfiguration图形处理单元←2160mm→←2400mm→3GB×44unit=132GBG８SizeTheCCDsensordetectthesubstrate,Imagebytheprocessunit.Defectcanbereviewedprecisely21TEST-O/STESTO/StestdesignPanelstructurefo

4、rO/STestEverydatalineextandsoutoftheactiveareaconnectwithO/SpadOntheothersidealldatalineconnectedtogetherbyShortingbar22TEST－ArrayTestArrayTester•Teststation•Electricalcabinet•Operatorconsole•EnvironmentalEnclosure23TEST-ArrayTESTArraytesterArraytesterUsinginstruct

5、ionsintheselectedprocessingrecipe,thepatterngeneratorsendstestsignalstotheprobeframe.Theilluminatoristurnedon,abiasvoltageappliedtothemodulatorandanimagecapturedbytheCCDcamera.Theimageissenttotheimageprocessingcomputer(IPPC)andpanelflawsareidentifiedandstoredinthed

6、efectfilebytheSunhostcomputer.ArraytesteropticalpartLightfromtheilluminatorisreflectedbythemodulatorandtheimagecapturedontheCCDcamera.Theimageisthenprocessedandanalyzedfordefects.24TEST-TEGTESTER25TEST-TEGMeasurementStructureMeasurementStructure26TEST-Arraylaserrep

7、air27TEST-ArraylaserconfigurationLASEROSCILLATOR:DIODE-PUMPEDQ-SWITCHEDLASERMATERIAL:Nd:YAGWAVELENGTH:1064nm/532nm/355nmPULSEREPETITIONRATE:1ppsTO100PPSOUTPUTSTABILITY:LESSTHAN±3%28TEST--CDC29TEST--CDCCDMeasurementTotalPitchMeasurementOverlayMeasurement30